ADF4360-0BCPZ Analog Devices Inc, ADF4360-0BCPZ Datasheet - Page 21

• Manufacturer Part Number: ADF4360-0BCPZ
• Description: IC INTEGRATED SYNTH/VCO 24-LFCSP
• Manufacturer: Analog Devices Inc
• Type: Fanout Distribution, Integer N Synthesizer (RF)r

Specifications of ADF4360-0BCPZ

• Pll: Yes
• Input: CMOS
• Output: Clock
• Number Of Circuits: 1
• Ratio - Input:output: 1:2
• Differential - Input:output: No/No
• Frequency - Max: 2.725GHz
• Divider/multiplier: Yes/No
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-LFCSP
• Frequency-max: 2.725GHz
• Pll Type: Frequency Synthesis
• Frequency: 2.725GHz
• Supply Current: 10mA
• Supply Voltage Range: 3V To 3.6V
• Digital Ic Case Style: LFCSP
• No. Of Pins: 24
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: EVAL-ADF4360-0EBZ1 - BOARD EVALUATION FOR ADF4360-0
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PCB DESIGN GUIDELINES FOR CHIP SCALE PACKAGE
The leads on the chip scale package (CP-24) are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package lead length and 0.05 mm wider than
the package lead width. The lead should be centered on the pad
to ensure that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern to ensure that short-
ing is avoided.
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at a
1.2 mm pitch grid. The via diameter should be between 0.3 mm
and 0.33 mm, and the via barrel should be plated with 1 ounce
of copper to plug the via.
The user should connect the printed circuit thermal pad to
AGND. This is internally connected to AGND.
OUTPUT MATCHING
There are a number of ways to match the output of the
ADF4360-0 for optimum operation; the most basic is to use a
50 Ω resistor to V
nected in series, as shown in Figure 20. Because the resistor is
not frequency dependent, this provides a good broadband
match. The output power in this circuit typically gives −6.5 dBm
output power into a 50 Ω load.
A better solution is to use a shunt inductor (acting as an RF
choke) to V
therefore, more output power. Additionally, a series inductor is
added after the dc bypass capacitor to provide a resonant LC
circuit. This tunes the oscillator output and provides approxi-
mately 10 dB additional rejection of the second harmonic. The
shunt inductor needs to be a relatively low value (<10 nH).
VCO
Figure 20. Simple ADF4360-1 Output Stage
. This gives a better match than a resistor and,
RF
VCO
V
VCO
OUT
. A dc bypass capacitor of 100 pF is con-
51Ω
100pF
50Ω
Rev. A | Page 21 of 24
Experiments have shown that the circuit shown in Figure 21
provides an excellent match to 50 Ω over the operating range of
the ADF4360-0. This gives approximately −4 dBm output power
across the frequency range of the ADF4360-0. Both single-
ended architectures can be examined using the EVAL-
ADF4360-0EB1 evaluation board.
If the user does not need the differential outputs available on
the ADF4360-0, the user may either terminate the unused out-
put or combine both outputs using a balun. The circuit in
Figure 22 shows how best to combine the outputs.
The circuit in Figure 22 is a lumped-lattice-type LC balun. It is
designed for a center frequency of 2.6 GHz and outputs −1 dBm
at this frequency. The series 1 nH inductor is used to tune out
any parasitic capacitance due to the board layout from each
input, and the remainder of the circuit is used to shift the
output of one RF input by +90° and the second by −90°, thus
combining the two. The action of the 3.6 nH inductor and the
1.5 pF capacitor accomplishes this. The 12 nH is used to provide
an RF choke to feed the supply voltage, and the 10 pF capacitor
provides the necessary dc block. To ensure good RF perform-
ance, the circuits in Figure 20 and Figure 22 are implemented
with Coilcraft 0402/0603 inductors and AVX 0402 thin-film
capacitors.
Alternatively, instead of the LC balun shown in Figure 22, both
outputs may be combined using a 180° rat-race coupler.
Figure 22. Balun for Combining ADF4360-0 RF Outputs
RF
RF
Figure 21. Differential ADF4360-0 Output Stage
OUT
OUT
A
B
RF
V
VCO
OUT
1nH
1nH
V
VCO
47nH
1.5pF
3.6nH
1.5pF
3.6nH
1.5pF
3.9nH
47nH
50Ω
10pF
ADF4360-0
50Ω