ICS853006AGLF IDT, Integrated Device Technology Inc, ICS853006AGLF Datasheet - Page 12

• Manufacturer Part Number: ICS853006AGLF
• Description: IC FANOUT BUFFER LVPECL 20-TSSOP
• Manufacturer: IDT, Integrated Device Technology Inc
• Series: HiPerClockS™r
• Type: Fanout Buffer (Distribution)r

Specifications of ICS853006AGLF

• Number Of Circuits: 1
• Ratio - Input:output: 1:6
• Differential - Input:output: Yes/Yes
• Input: CML, LVDS, LVPECL, SSTL
• Output: ECL, LVPECL
• Frequency - Max: 2GHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• Frequency-max: 2GHz
• Number Of Outputs: 12
• Operating Supply Voltage (max): -3.465/3.465V
• Operating Temp Range: -40C to 85C
• Propagation Delay Time: 0.51ns
• Operating Supply Voltage (min): -2.375/2.375V
• Mounting: Surface Mount
• Pin Count: 20
• Operating Supply Voltage (typ): -2.5/-3.3/3.3V
• Package Type: TSSOP
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 800-1157; 800-1157-5; 800-1157; 853006AGLF

IDT™ / ICS™ LOW SKEW, 1-TO-6 DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
ICS853006
LOW SKEW, 1-TO-6 DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
This section provides information on power dissipation and junction temperature for the ICS853006.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS853006 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
T
853006AG
ABLE
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
6. T
Power (core)
Power (outputs)
If all outputs are loaded, the total power is 6 * 30.94mW = 185.64mW
Total Power
The equation for Tj is as follows: Tj =
Tj = Junction Temperature
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
85°C + 0.584W * 66.6°C/W = 123.9°C. This is below the limit of 125°C
JA
A
= Ambient Temperature
= Junction-to-Ambient Thermal Resistance
HERMAL
Integrated
Circuit
Systems, Inc.
R
MAX
ESISTANCE
_MAX
MAX
= V
= 30.94mW/Loaded Output pair
(3.465V, with all outputs switching) = 398.48mW + 185.64mW = 584.12mW
CC_MAX
* I
JA
EE_MAX
FOR
D
JA
P
CC
= 3.465V * 115mA = 398.48mW
IFFERENTIAL
20-
by Velocity (Linear Feet per Minute)
= 3.465V, which gives worst case results.
www.icst.com/products/hiperclocks.html
OWER
PIN
JA
* Pd_total + T
TSSOP, F
C
-
ONSIDERATIONS
TO
ORCED
A
12
-2.5V/3.3V LVPECL/ECL F
12
114.5°C/W
73.2°C/W
C
0
ONVECTION
TM
devices is 125°C.
98.0°C/W
66.6°C/W
200
JA
must be used . Assuming a
L
OW
88.0°C/W
63.5°C/W
500
ANOUT
REV. A NOVEMBER 9, 2004
S
KEW
, 1-
B
UFFER
TO
ICS853006
-6
TSD