ICS854S204BGILF IDT, Integrated Device Technology Inc, ICS854S204BGILF Datasheet - Page 16

• Manufacturer Part Number: ICS854S204BGILF
• Description: IC CLK FANOUT BUFFER 1:2 16TSSOP
• Manufacturer: IDT, Integrated Device Technology Inc
• Series: HiPerClockS™r
• Type: Fanout Buffer (Distribution)r

Specifications of ICS854S204BGILF

• Number Of Circuits: 2
• Ratio - Input:output: 1:2
• Differential - Input:output: Yes/Yes
• Input: CML, LVDS, LVPECL, SSTL
• Output: LVDS, LVPECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP
• Frequency-max: 3GHz
• Number Of Outputs: 8
• Operating Supply Voltage (max): 3.465V
• Operating Temp Range: -40C to 85C
• Propagation Delay Time: 0.5ns
• Operating Supply Voltage (min): 2.375V
• Mounting: Surface Mount
• Pin Count: 16
• Operating Supply Voltage (typ): 2.5/3.3V
• Package Type: TSSOP
• Duty Cycle: 51%
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 800-1964-5; 854S204BGILF; ICS854S204BGILF

T
IDT
This section provides information on power dissipation and junction temperature for the ICS854S204I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS854S204I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
air flow and a multi-layer board, the appropriate value is 92°C/W per Table 6B below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
ABLE
ICS854S204I
LOW SKEW, DUAL, 1-TO-2 DIFFERENTIAL-TO-LVDS, LVPECL FANOUT BUFFER
™
/ ICS
Multi-Layer PCB, JEDEC Standard Test Boards
6B. T
™
Power
The equation for Tj is as follows: Tj =
Tj = Junction Temperature
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
85°C + 0.416W * 92°C/W = 123.3°C. This is below the limit of 125°C.
JA
A
LVDS, LVPECL FANOUT BUFFER
= Ambient Temperature
= Junction-to-Ambient Thermal Resistance
HERMAL
_MAX
= V
R
DD_MAX
ESISTANCE
* I
P
DD_MAX
OWER
= 3.465V * 120mA = 415.8mW
JA
FOR
16-L
C
DD
= 3.3V + 5% = 3.465V, which gives worst case results.
JA
ONSIDERATIONS
EAD
by Velocity (Meters per Second)
JA
* Pd_total + T
TSSOP, F
ORCED
A
16
92°C/W
0
C
ONVECTION
(LVDS O
TM
devices is 125°C.
87.6°C/W
1
UTPUTS
ICS854S204BGI REV. A JUNE 4, 2008
85.5°C/W
JA
must be used. Assuming no
2.5
)