ICS8305AGLF IDT, Integrated Device Technology Inc, ICS8305AGLF Datasheet - Page 14
ICS8305AGLF
Manufacturer Part Number
ICS8305AGLF
Description
IC CLK FAN BUFF MUX 2:4 16TSSOP
Manufacturer
IDT, Integrated Device Technology Inc
Type
Fanout Buffer (Distribution), Multiplexerr
Series
HiPerClockS™r
Datasheet
1.ICS8305AGLF.pdf
(17 pages)
Specifications of ICS8305AGLF
Number Of Circuits
1
Ratio - Input:output
2:4
Differential - Input:output
Yes/No
Input
HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL
Output
LVCMOS, LVTTL
Frequency - Max
350MHz
Voltage - Supply
3.135 V ~ 3.465 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
16-TSSOP
Frequency-max
350MHz
Number Of Clock Inputs
2
Output Frequency
350MHz
Output Logic Level
LVCMOS/LVTTL
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.465V
Package Type
TSSOP
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
16
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
800-1110
800-1110-5
800-1110
8305AGLF
800-1110-5
800-1110
8305AGLF
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ICS8305AGLF
Manufacturer:
IDT Integrated Device Technolo
Quantity:
1 818
Company:
Part Number:
ICS8305AGLF
Manufacturer:
IDT
Quantity:
1 727
Company:
Part Number:
ICS8305AGLF
Manufacturer:
IDT
Quantity:
3
Part Number:
ICS8305AGLF
Manufacturer:
ICS
Quantity:
20 000
Reliability Information
Table 6.
NOTE: Most modern PCB design use multi-layered boards. The data in the second row pertains to most designs.
Transistor Count
The transistor count for ICS8305: 459
Package Outline and Package Dimensions
Package Outline - G Suffix for 16 Lead TSSOP
IDT™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER
Linear Feet per Minute
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
ICS8305
LOW SKEW, 1-TO-4 MULTIPLEXED DIFFERENTIAL/LVCMOS-TO-LVCMOS/LVTTL FANOUT BUFFER
θ
JA
vs. Air Flow Table for a 16 Lead TSSOP
θ
137.1°C/W
JA
89.0°C/W
vs. Air Flow
0
14
Table 7. Package Dimensions for 16 Lead TSSOP
Reference Document: JEDEC Publication 95, MO-153
Symbol
aaa
A1
A2
E1
All Dimensions in Millimeters
N
A
D
E
α
b
c
e
L
118.2°C/W
81.8°C/W
Minimum
200
0.80
0.19
0.09
4.90
4.30
0.45
0.5
0°
ICS8305AG REV. C OCTOBER 23, 2008
6.40 Basic
0.65 Basic
16
Maximum
1.20
0.15
1.05
0.30
0.20
5.10
4.50
0.75
0.10
8°
106.8°C/W
78.1°C/W
500