SPB11N60C3XT Infineon Technologies, SPB11N60C3XT Datasheet

SPB11N60C3XT

Manufacturer Part Number
SPB11N60C3XT
Description
Manufacturer
Infineon Technologies
Type
Power MOSFETr
Datasheet

Specifications of SPB11N60C3XT

Number Of Elements
1
Polarity
N
Channel Mode
Enhancement
Drain-source On-res
0.38Ohm
Drain-source On-volt
600V
Gate-source Voltage (max)
±20V
Drain Current (max)
11A
Output Power (max)
Not RequiredW
Frequency (max)
Not RequiredMHz
Noise Figure
Not RequireddB
Power Gain
Not RequireddB
Drain Efficiency
Not Required%
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
2 +Tab
Package Type
TO-263
Power Dissipation
125W
Lead Free Status / RoHS Status
Compliant
Cool MOS™ Power Transistor
Feature
• New revolutionary high voltage technology
• Ultra low gate charge
• Periodic avalanche rated
• Extreme dv/dt rated
• High peak current capability
• Improved transconductance
Type
SPB11N60C3
Maximum Ratings
Parameter
Continuous drain current
T
T
Pulsed drain current, t
Avalanche energy, single pulse
I
Avalanche energy, repetitive t
I
Avalanche current, repetitive t
Gate source voltage static
Gate source voltage AC (f >1Hz)
Power dissipation,
Operating and storage temperature
Reverse diode dv/dt
D
D
C
C
Rev. 2.6
=5.5A, V
=11A, V
= 25 °C
= 100 °C
DD
DD
=50V
=50V
T
Package
PG-TO263
C
7)
= 25°C
p
limited by T
AR
AR
limited by T
limited by T
jmax
Ordering Code
Q67040-S4396
Page 1
jmax
jmax
2)
Symbol
I
I
E
E
I
V
V
P
T
dv/dt
D
D puls
AR
j ,
AS
AR
GS
GS
tot
Marking
11N60C3
T
stg
V
DS
R
SPB
340
±20
±30
125
0.6
DS(on)
11
33
11
@ T
7
I
D
-55...+150
Value
jmax
15
SPB11N60C3
2007-12-14
PG-TO263
0.38
650
11
V/ns
Unit
A
A
mJ
A
V
W
°C
V
A

Related parts for SPB11N60C3XT

SPB11N60C3XT Summary of contents

Page 1

Cool MOS™ Power Transistor Feature • New revolutionary high voltage technology • Ultra low gate charge • Periodic avalanche rated • Extreme dv/dt rated • High peak current capability • Improved transconductance Type Package SPB11N60C3 PG-TO263 Maximum Ratings Parameter Continuous ...

Page 2

Maximum Ratings Parameter Drain Source voltage slope = 480 125 ° Thermal Characteristics Parameter Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on ...

Page 3

Electrical Characteristics Parameter Transconductance Input capacitance Output capacitance Reverse transfer capacitance Effective output capacitance, energy related Effective output capacitance, time related Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to ...

Page 4

Electrical Characteristics Parameter Inverse diode continuous forward current Inverse diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge Peak reverse recovery current Peak rate of fall of reverse recovery current Typical Transient Thermal Characteristics Symbol ...

Page 5

Power dissipation tot C SPP11N60C3 140 W 120 110 100 Safe operating area ...

Page 6

Transient thermal impedance thJC p parameter K Typ. ...

Page 7

Typ. drain-source on resistance R =f(I ) DS(on) D parameter: T =150° Ω 4. 1.6 1.4 1.2 1 0.8 0.6 0 Typ. transfer characteristics ≥ 2 ...

Page 8

Forward characteristics of body diode parameter µ SPP11N60C3 °C typ 150 °C ...

Page 9

Typ. drain source voltage slope dv/dt = f(R ), inductive load par.: V =380V, V =0/+13V 140 V/ns dv/dt(off) 120 110 100 dv/dt(on ...

Page 10

Avalanche energy par 5 350 mJ 250 200 150 100 100 23 Avalanche power losses P = ...

Page 11

Typ. C stored energy oss E =f(V ) oss DS 7.5 µJ 6 5.5 5 4.5 4 3.5 3 2.5 2 1 100 200 300 Definition of diodes switching characteristics Rev. 2.6 400 600 V ...

Page 12

PG-TO263 Rev. 2.6 Page 12 SPB11N60C3 2007-12-14 ...

Page 13

... Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system ...

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