NAND256W3A2BN6F NUMONYX, NAND256W3A2BN6F Datasheet

no-image

NAND256W3A2BN6F

Manufacturer Part Number
NAND256W3A2BN6F
Description
Manufacturer
NUMONYX
Datasheet

Specifications of NAND256W3A2BN6F

Cell Type
NAND
Density
256Mb
Access Time (max)
12us
Interface Type
Parallel
Boot Type
Not Required
Address Bus
25b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
32M
Supply Current
20mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NAND256W3A2BN6F
Manufacturer:
ST
Quantity:
4 000
Part Number:
NAND256W3A2BN6F
Manufacturer:
ST
0
Part Number:
NAND256W3A2BN6F
Manufacturer:
ST
Quantity:
20 000
Features
November 2009
High density NAND flash memories
– Up to 256-Mbit memory array
– Up to 32-Mbit spare area
– Cost effective solutions for mass storage
– x8 or x16 bus width
– Multiplexed address/data
– Pinout compatibility for all densities
Supply voltage
– V
Page size
– x8 device: (512 + 16 spare) bytes
– x16 device: (256 + 8 spare) words
Block size
– x8 device: (16 K + 512 spare) bytes
– x16 device: (8 K + 256 spare) words
Page read/program
– Random access: 12 µs (max)
– Sequential access: 50 ns (min)
– Page program time: 200 µs (typ)
Copy back program mode
– Fast page copy without external buffering
Fast block erase
– Block erase time: 2 ms (typical)
Status register
Electronic signature
Chip enable ‘don’t care’
– Simple interface with microcontroller
Security features
– OTP area
– Serial number (unique ID)
NAND interface
applications
DD
= 2.7 to 3.6 V
128-Mbit or 256-Mbit, 528-byte/264-word page,
Rev 16
NAND128-A NAND256-A
3 V, SLC NAND flash memories
Hardware data protection
– Program/erase locked during power
Data integrity
– 100,000 program/erase cycles
– 10 years data retention
RoHS compliance
– Lead-free components are compliant with
Development tools
– Error correction code software and
– Bad blocks management and wear leveling
– File system OS native reference software
– Hardware simulation models
transitions
the RoHS directive
hardware models
algorithms
VFBGA55 8 x 10 x 1.05 mm
TSOP48 12 x 20 mm
FBGA
www.numonyx.com
1/59
1

Related parts for NAND256W3A2BN6F

NAND256W3A2BN6F Summary of contents

Page 1

... Lead-free components are compliant with Development tools – Error correction code software and – Bad blocks management and wear leveling – File system OS native reference software – Hardware simulation models Rev 16 TSOP48 FBGA VFBGA55 1.05 mm transitions the RoHS directive hardware models algorithms 1/59 www.numonyx.com 1 ...

Page 2

Contents Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 3

NAND128-A, NAND256-A 6.4 Copy back program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 4

List of tables List of tables Table 1. NAND128-A and NAND256-A device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 5

NAND128-A, NAND256-A List of figures Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 6

... Each block can be programmed and erased up to 100,000 cycles. To extend the lifetime of NAND flash devices it is strongly recommended to implement an error correction code (ECC). A Write Protect pin is available to provide hardware protection against program and erase operations. ...

Page 7

... Serial number (unique identifier), which enables each device to be uniquely identified subject to an NDA and is, therefore, not described in the datasheet. For more details about these security features, contact your nearest Numonyx sales office. For information on how to order these devices refer to scheme. Devices are shipped from the factory with block 0 always valid and the memory content bits in valid blocks erased to ’ ...

Page 8

... Ready/Busy (open-drain output) W Write Enable WP Write Protect V Supply voltage DD V Ground SS NC Not connected internally DU Do not use 8/ I/O8-I/O15, x16 E I/O0-I/O7, x8/x16 R W NAND flash Function NAND128-A, NAND256-A AI07557C Direction I/O I/O Input Input Input Input Output Input Input Supply Ground – ...

Page 9

... NAND128-A, NAND256-A Figure 2. Logic block diagram Address register/counter Command interface E logic WP R Command register NAND flash memory array P/E/R controller, high voltage generator Page buffer Y decoder I/O buffers & latches RB I/O0-I/O7, x8/x16 I/O8-I/O15, x16 Description AI07561c 9/59 ...

Page 10

... Description Figure 3. TSOP48 connections, x8 devices 10/ NAND flash (x8 NAND128-A, NAND256 I/O7 I/O6 I/O5 I/ I/O3 I/O2 I/O1 I/ AI07585C ...

Page 11

... NAND128-A, NAND256-A Figure 4. TSOP48 connections, x16 devices NAND flash (x16 Description V SS I/O15 I/O7 I/O14 I/O6 I/O13 I/O5 I/O12 I/ I/O11 I/O3 I/O10 I/O2 I/O9 I/O1 I/O8 I/ AI07559C 11/59 ...

Page 12

Description Figure 5. VFBGA55 connections, x8 devices (top view through package 12/ ...

Page 13

NAND128-A, NAND256-A Figure 6. VFBGA55 connections, x16 devices (top view through package ...

Page 14

... Refer to 2.1 Bad blocks The NAND flash 528-byte/264-word page devices may contain bad blocks, that is blocks that contain one or more invalid bits whose reliability is not guaranteed. Additional bad blocks may develop during the lifetime of the device. The bad block information is written prior to shipping (refer to more details) ...

Page 15

NAND128-A, NAND256-A Figure 7. Memory array organization 1st half page (256 bytes) Block Page 512 bytes Page buffer, 512 bytes x8 DEVICES Block = 32 pages Page = 528 bytes (512+16) 2nd half page (256 bytes) Block Page 8 bits ...

Page 16

Signal descriptions 3 Signal descriptions See Figure 1: Logic diagram connected to this device. 3.1 Inputs/outputs (I/O0-I/O7) Input/outputs input the selected address, output the data during a read operation or input a command or data during a ...

Page 17

NAND128-A, NAND256-A 3.6 Read Enable (R) Read Enable, R, controls the sequential data output during read operations. Data is valid t after the falling edge of R. The falling edge of R also increments the internal column RLQV address counter ...

Page 18

Signal descriptions 3.11 V ground SS Ground the reference for the power supply. It must be connected to the system SS, ground. 18/59 NAND128-A, NAND256-A ...

Page 19

NAND128-A, NAND256-A 4 Bus operations There are six standard bus operations that control the memory. Each of these is described in this section, see 4.1 Command input Command input bus operations give commands to the memory. Commands are accepted when ...

Page 20

Bus operations 4.4 Data output Data output bus operations read the data in the memory array, the status register, the electronic signature, and the serial number. Data is output when Chip Enable is Low, Write Enable is High, Address Latch ...

Page 21

NAND128-A, NAND256-A Table 7. Address insertion, x16 devices I/O8- Bus Cycle I/O15 ’don’t care’ in x16 devices. 2. Any additional address input cycles are ignored. 3. The 01h ...

Page 22

Command set 5 Command set All bus write operations to the device are interpreted by the command interface. The commands are input on I/O0-I/O7 and are latched on the rising edge of Write Enable when the Command Latch Enable signal ...

Page 23

... Device operations 6.1 Pointer operations As the NAND flash memories contain two different areas for x16 devices and three different areas for x8 devices (see to the different areas of the memory array (they select the most significant column address). The Read A and Read B commands act as pointers to the main memory area. Their use depends on the bus width of the device ...

Page 24

Device operations Figure 9. Pointer operations for programming 80h I/O 00h Areas can be programmed depending on how much data is input. Subsequent 00h commands can be omitted. 80h I/O 01h Areas B, C can be programmed ...

Page 25

NAND128-A, NAND256-A and Chip Enable remains Low, then the next page is automatically loaded into the page buffer and the read operation continues. A sequential row read operation can only be used to read within a block. If the block ...

Page 26

Device operations Figure 12. Sequential row read operations (Read busy time) RB 00h/ I/O Address inputs 01h/ 50h Command code Figure 13. Sequential row read block diagrams Read A command, x8 devices Area B Area A (2nd half Page) (1st ...

Page 27

NAND128-A, NAND256-A 6.3 Page program The page program operation is the standard operation to program data to the memory array. The main area of the memory array is programmed by page, however partial page programming is allowed where any number ...

Page 28

Device operations 6.4 Copy back program The copy back program operation copies the data stored in one page and reprogram it in another page. The copy back program operation does not require external memory and so the operation is faster ...

Page 29

NAND128-A, NAND256-A 6.5 Block erase Erase operations are done one block at a time. An erase operation sets all of the bits in the addressed block to ‘1’. All previous data in the block is lost. An erase operation consists ...

Page 30

Device operations After the read status register command has been issued, the device remains in read status register mode until another command is issued. therefore if a read status register command is issued during a random read cycle a new ...

Page 31

NAND128-A, NAND256-A Refer to Table 12 Table 12. Electronic signature Part number NAND128W3A NAND256W3A NAND256W4A for information on the addresses. Manufacturer code Device operations Device code 20h 73h 20h 75h 0020h 0055h 31/59 ...

Page 32

... For the integration of NAND memories into an application, Numonyx provides a full range of software solutions such as file systems, sector managers, drivers, and code management. Contact the nearest Numonyx sales office or visit www.numonyx.com for more details. ...

Page 33

NAND128-A, NAND256-A Refer to Table 13 operation. Table 13. Block failure Operation Erase Program Read Figure 17. Bad block management flowchart for the recommended procedure to follow if an error occurs during an START Block Address = Block 0 Data ...

Page 34

Software algorithms 7.3 Garbage collection When a data page needs to be modified faster to write to the first available page, and the previous page is marked as invalid. After several updates it is necessary to remove invalid ...

Page 35

... NAND128-A, NAND256-A 7.5 Error correction code An error correction code (ECC) can be implemented in the NAND flash memories to identify and correct errors in the data. The recommendation is to implement 23 bits of ECC for every 4096 bits in the device. Figure 19. Error detection 7.6 Hardware simulation models 7 ...

Page 36

... The program and erase times and the number of program/ erase cycles per block are shown in Table 14. Table 14. Program, erase times and program erase endurance cycles Parameters Page program time Block erase time Program/erase cycles (per block) Data retention 36/59 NAND128-A, NAND256-A NAND flash Min Typ 200 2 100,000 10 Unit Max 500 µ ...

Page 37

NAND128-A, NAND256-A 9 Maximum ratings Stressing the device above the ratings listed in cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the ...

Page 38

... V devices (2 TTL GATE devices (3.0 - 3.6V devices 3 V devices ref (1)(2) Parameter Test condition Input capacitance and C are not 100% tested. IN I/O NAND128-A, NAND256-A NAND flash Min Max 2.7 3.6 – 100 0.4 2.4 1.5 5 8.35 Typ Max = Units V ° ...

Page 39

... NAND128-A, NAND256-A Figure 20. Equivalent testing circuit for AC characteristics measurement V DD NAND Flash C L GND DC and AC parameters 2R ref 2R ref GND Ai11085 39/59 ...

Page 40

DC and AC parameters Table 18. DC characteristics Symbol I DD1 Operating current I DD2 I DD3 I Standby current (TTL) DD4 I Standby current (CMOS) DD5 I Input leakage current LI I Output leakage current LO V Input High ...

Page 41

NAND128-A, NAND256-A t Table 19. AC characteristics for command, address, data input Alt. Symbol symbol t Address Latch Low to Write Enable Low ALLWL t ALS t Address Latch High to Write Enable Low ALHWL t Command Latch High to ...

Page 42

DC and AC parameters Table 20. AC characteristics for operations Alt. Symbol symbol t Address Latch Low to ALLRL1 t AR Read Enable Low t ALLRL2 t t Ready/Busy High to Read Enable Low BHRL RR t BLBH1 Ready/Busy Low ...

Page 43

NAND128-A, NAND256-A Figure 21. Command Latch AC waveforms I/O Figure 22. Address Latch AC waveforms CL tELWL (E Setup time tALHWL (AL Setup time) AL I/O tCLHWL (CL Setup time) tELWL (E Setup time) ...

Page 44

DC and AC parameters Figure 23. Data Input Latch AC waveforms CL E tALLWL (ALSetup time I/O Figure 24. Sequential data output after read AC waveforms Low Low High. 44/59 tWLWL ...

Page 45

NAND128-A, NAND256-A Figure 25. Read status register AC waveform Figure 26. Read electronic signature AC waveform I/O Read Electronic 1. Refer to Table 12: Electronic signature tALLRL1 tRLQV (Read ES Access time) Man. 90h 00h ...

Page 46

DC and AC parameters Figure 27. Page read A/read B operation AC waveform 00h or I/O 01h Command Code Figure 28. Read C operation, one page AC waveform I/O ...

Page 47

NAND128-A, NAND256-A Figure 29. Page program AC waveform I/O 80h RB Page Program Setup Code Figure 30. Block erase AC waveform I/O RB Block Erase Setup Command tWLWL tWLWL (Write ...

Page 48

DC and AC parameters Figure 31. Reset AC waveform I/O RB 10.1 Ready/busy signal electrical characteristics Figures Figure 32, Ready/Busy signal. The value required for the resistor R following equation: Therefore, where I is the sum ...

Page 49

NAND128-A, NAND256-A Figure 33. Ready/busy load circuit Figure 34. Resistor value versus waveform timings for Ready/Busy signal ° DEVICE RB Open Drain Output and AC parameters ibusy AI07563B 49/59 ...

Page 50

... DC and AC parameters 10.2 Data protection The Numonyx NAND device is designed to guarantee data protection during power transitions detection circuit disables all NAND operations the V range from V DD Low ( guarantee hardware protection during power transitions as shown in the below IL figure. Figure 35. Data protection V DD ...

Page 51

... NAND128-A, NAND256-A 11 Package mechanical To meet environmental requirements, Numonyx offers these devices in RoHS compliant packages, which have a lead-free second-level interconnect. The category of second-level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...

Page 52

Package mechanical Figure 37. VFBGA55 active ball array, 0.8 mm pitch, package outline 1. Drawing is not to scale. 52/ FE1 FD1 ...

Page 53

NAND128-A, NAND256-A Table 22. VFBGA55 1. ball array, 0.8 mm pitch, package mechanical data Symbol ddd FD1 ...

Page 54

... F = RoHS compliant package, tape and reel packing 1. 1. x16 organization only available for MCP. Note: Not all combinations are necessarily available. For a list of available devices or for further information on any aspect of these products, please contact your nearest Numonyx sales office. 54/59 NAND128-A, NAND256-A NAND128 ...

Page 55

... NAND128-A, NAND256-A Appendix A Hardware interface examples NAND flash devices can be connected to a microcontroller system bus for code and data storage. For microcontrollers that have an embedded NAND controller the NAND flash can be connected without the addition of glue logic (see logic is required for general purpose microcontrollers that do not have an embedded NAND controller ...

Page 56

... Hardware interface examples Figure 39. Connection to microcontroller, with glue logic Microcontroller Figure 40. Building storage modules NAND Flash W Device 56/ CSn A3 CLK NAND Flash NAND Flash Device 2 Device 3 NAND128-A, NAND256 flip-flop NAND Flash I NAND Flash Device n I/O0-I/O7 or I/O0-I/O15 AI07589 E n+1 NAND Flash Device n+1 AI08331 ...

Page 57

NAND128-A, NAND256-A 13 Revision history Table 24. Document revision history Date Version 06-Jun-2003 07-Aug-2003 27-Oct-2003 03-Dec-2003 13-Apr-2004 28-May-2004 02-Jul-2004 01-Oct-2004 03-Dec-2004 1 Initial release 2 Design phase 3 Engineering phase Document promoted from Target Specification to Preliminary Data status. V ...

Page 58

... TSOP48 connections, x16 devices Removed all information pertaining to the 512-Mbit and 1-Gbit devices. 14 Applied Numonyx branding. Removed all the information pertaining the 1.8 V devices (V 15 1.95 V) and the USOP48 and VFBGA63 packages. Added the sequential row read option throughout the document. ...

Page 59

... NUMONYX PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Numonyx products are not intended for use in medical, life saving, life sustaining, critical control or safety systems nuclear facility Numonyx may make changes to specifications and product descriptions at any time, without notice. ...

Related keywords