MT47H32M16HR-25E:F Micron Technology Inc, MT47H32M16HR-25E:F Datasheet - Page 22
![](/photos/31/34/313419/mfg557-84-fbga_sml.jpg)
MT47H32M16HR-25E:F
Manufacturer Part Number
MT47H32M16HR-25E:F
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H32M16HR-25EF.pdf
(132 pages)
Specifications of MT47H32M16HR-25E:F
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
400ps
Maximum Clock Rate
800MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
295mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H32M16HR-25E:F
Manufacturer:
ON
Quantity:
700
Part Number:
MT47H32M16HR-25E:F
Manufacturer:
MICRON
Quantity:
20 000
Table 6: Temperature Limits
Figure 10: Example Temperature Test Point Location
Table 7: Thermal Impedance
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
Parameter
Storage temperature
Operating temperature: commercial
Operating temperature: industrial
Operating temperature: automotive
Die Revision
F
1
Package Substrate
60-ball
84-ball
Notes:
Test point
2-layer
4-layer
2-layer
4-layer
1. MAX storage case temperature T
2. MAX operating case temperature T
3. Device functionality is not guaranteed if the device exceeds maximum T
4. Both temperature specifications must be satisfied.
5. Operating ambient temperature surrounding the package.
in Figure 10. This case temperature limit is allowed to be exceeded briefly during pack-
age reflow, as noted in Micron technical note TN-00-15, “Recommended Soldering
Parameters.”
in Figure 10.
operation.
Lmm x Wmm FBGA
Airflow = 0m/s
Θ JA (°C/W)
Width (W)
71.4
53.6
65.8
50.0
0.5 (W)
Airflow = 1m/s
Electrical Specifications – Absolute Ratings
Symbol
0.5 (L)
22
Θ JA (°C/W)
T
T
T
T
T
T
Length (L)
STG
C
C
A
C
A
54.1
44.5
50.4
41.3
STG
C
Micron Technology, Inc. reserves the right to change products or specifications without notice.
is measured in the center of the package, as shown
is measured in the center of the package, as shown
Min
512Mb: x4, x8, x16 DDR2 SDRAM
–55
–40
–40
–40
–40
0
Airflow = 2m/s Θ JB (°C/W) Θ JC (°C/W)
Θ JA (°C/W)
47.5
40.5
44.3
37.7
Max
150
105
105
85
95
85
© 2004 Micron Technology, Inc. All rights reserved.
Units
°C
°C
°C
°C
°C
°C
33.7
33.5
30.7
30.5
C
during
2, 3 , 4
Notes
2, 3, 4
2, 3
4, 5
4, 5
1
5.5
4.1