MT48LC2M32B2P-6:G Micron Technology Inc, MT48LC2M32B2P-6:G Datasheet - Page 45

IC, SDRAM, 64MBIT, 166MHZ, TSOP-86

MT48LC2M32B2P-6:G

Manufacturer Part Number
MT48LC2M32B2P-6:G
Description
IC, SDRAM, 64MBIT, 166MHZ, TSOP-86
Manufacturer
Micron Technology Inc
Type
SDRAMr
Series
-r
Datasheets

Specifications of MT48LC2M32B2P-6:G

Organization
2Mx32
Density
64Mb
Address Bus
13b
Access Time (max)
17/7.5/5.5ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
180mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Memory Type
DRAM - Sychronous
Access Time
5.5ns
Page Size
64Mbit
Memory Case Style
TSOP
No. Of Pins
86
Operating Temperature Range
0°C To +70°C
Frequency
166MHz
Supply Voltage
3.3V
Format - Memory
RAM
Memory Size
64M (2Mx32)
Speed
167MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
86-TFSOP (0.400", 10.16mm Width)
Filter Terminals
SMD
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC2M32B2P-6:G
Quantity:
106
Part Number:
MT48LC2M32B2P-6:G
Manufacturer:
MICRON
Quantity:
20 000
Table 14:
Table 15:
Table 16:
Table 17:
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. M 10/07 EN
Parameter/Condition
Parameter/Condition
Parameter
Parameter
Supply voltage
Input high voltage: Logic 1; All inputs
Input low voltage: Logic 0; All inputs
Input leakage current:
Any input 0V ≤ V
Output leakage current: DQs are disabled; 0V ≤ V
Output levels:
Output high voltage (Iout = –4mA)
Output low voltage (Iout = 4mA)
Operating current: active mode;
Burst = 2; READ or WRITE;
Standby current: Power-down mode;
All banks idle; CKE = LOW
Standby current: Active mode;
CKE = HIGH; CS# = HIGH; All banks active after
No accesses in progress
Operating current: Burst mode;
Page burst; READ or WRITE; All banks active
Auto refresh current:
CKE = HIGH; CS# = HIGH
Self refresh current:
CKE ≤ 0.2V
Input capacitance: CLK
Input capacitance: All other input-only pins
Input/output capacitance: DQs
Input capacitance: CLK
Input capacitance: All other input-only pins
Input/output capacitance: DQs
DC Electrical Characteristics and Operating Conditions
Notes 1, 5, 6 apply to entire table; notes appear on pages 48 and 49; V
I
Notes 1, 5, 6 apply to entire table; notes appear on pages 48 and 49; V
TSOP Capacitance
Note 2 applies to entire table; notes appear on pages 48 and 49
VFBGA Capacitance
Note 2 applies to entire table; notes appear on pages 48 and 49
DD
IN
Specifications and Conditions
≤ V
DD
(All other pins not under test = 0V)
t
RC ≥
t
RC (MIN)
t
t
Standard
Low power (L)
RFC =
RFC = 15.625µs
t
RCD met;
OUT
t
≤ V
RFC (MIN)
DD
Q
45
V
Symbol
DD
Symbol
Symbol
Symbol
V
V
V
, V
I
I
I
I
I
I
I
I
V
OZ
DD
DD
DD
DD
DD
DD
DD
OH
I
OL
IH
C
C
C
C
C
C
IL
I
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD
I
I
IO
I
I
IO
1
2
3
4
5
6
7
1
2
1
2
Q
150
180
250
0.5
60
-6
2
3
1
Min
Min
Min
–0.3
TBD
TBD
TBD
2.4
2.5
2.5
4.0
–5
–5
3
2
DD
DD
Max
125
150
230
, V
, V
-7E
0.5
64Mb: x4, x8, x16 SDRAM
45
2
3
1
Electrical Specifications
DD
V
DD
DD
Max
Max
Max
Q = +3.3V ±0.3V
Q = +3.3V ±0.3V
TBD
TBD
TBD
3.6
0.8
0.4
3.5
3.8
6.0
5
5
+ 0.3
©2000 Micron Technology, Inc. All rights reserved.
115
140
210
-75
0.5
45
2
3
1
Units
Units
Units
Units
µA
µA
pF
pF
pF
pF
pF
pF
mA
mA
mA
mA
mA
mA
V
V
V
V
V
19, 32, 33
3, 18, 19,
3, 12, 19,
3, 18, 19,
3, 12, 18,
Notes
Notes
Notes
Notes
22
22
32
32
32
32
29
30
31
29
30
31
4

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