STM8AF6246TDSSSX STMicroelectronics, STM8AF6246TDSSSX Datasheet - Page 88
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STM8AF6246TDSSSX
Manufacturer Part Number
STM8AF6246TDSSSX
Description
8 BITS MICROCONTR
Manufacturer
STMicroelectronics
Series
STM8Ar
Datasheet
1.STM8AF5289TCY.pdf
(106 pages)
Specifications of STM8AF6246TDSSSX
Core Processor
STM8A
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Eeprom Size
512 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 150°C
Package / Case
32-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM8AF6246TDSSSX
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM8AF6246TDSSSX
Manufacturer:
ST
Quantity:
20 000
Electrical characteristics
10.4
10.4.1
88/106
Thermal characteristics
In case the maximum chip junction temperature (T
operating conditions
T
Equation 3
where:
where:
Equation 4
taking into account the actual V
application.
Table 50.
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
Jmax
environment.
Symbol
T
Θ
P
P
internal power.
P
, in degrees Celsius, may be calculated using the following equation:
Θ
Θ
Θ
Θ
Amax
Dmax
INTmax
I/Omax
JA
JA
JA
JA
JA
is the package junction-to-ambient thermal resistance in ° C/W
is the maximum ambient temperature in °C
is the sum of P
Thermal characteristics
represents the maximum power dissipation on output pins
is the product of I
Thermal resistance junction-ambient
LQFP 80 - 14 x 14 mm
Thermal resistance junction-ambient
LQFP 64 - 10 x 10 mm
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
is exceeded, the functionality of the device cannot be guaranteed.
P
INTmax
I/Omax
T
Doc ID 14395 Rev 8
DD
OL
Jmax
= Σ (V
and P
and V
/ I
Parameter
OL
= T
(1)
and V
OL
I/Omax
DD
Amax
, expressed in Watts. This is the maximum chip
* I
OH
OL
+ (P
(P
) + Σ((V
/ I
Dmax
Dmax
OH
Jmax
of the I/Os at low- and high-level in the
= P
) specified in
x Θ
DD
STM8AF52/62xx, STM8AF51/61xx
INTmax
- V
JA
)
OH
) * I
+ P
OH
I/Omax
Table 25: General
)
Value
38
46
57
59
)
°C/W
°C/W
°C/W
°C/W
Unit