PCF2123TS/1.118 NXP Semiconductors, PCF2123TS/1.118 Datasheet - Page 51

• Manufacturer Part Number: PCF2123TS/1.118
• Manufacturer: NXP Semiconductors

Specifications of PCF2123TS/1.118

• Bus Type: Serial (3-Wire, SPI)
• Package Type: TSSOP
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Mounting: Surface Mount
• Date Format: DW:DM:M:Y
• Time Format: HH:MM:SS
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
PCF2123
Product data sheet
Table 47.
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip; see
Table 48.
[1]
[2]
Symbol
SDO
SDI
SCL
CLKOE
CLKOUT
V
OSCI
CE
Coordinates
x
Location
693
Dimension
16 μm
OSCO
TEST
INT
V
Fig 35. Alignment mark
DD
SS
The x/y coordinates of the alignment mark location represent the position of the REF point (see
with respect to the center (x/y = 0) of the chip; see
The x/y values of the dimensions represent the extensions of the alignment mark in direction of the
coordinate axis (see
[1]
Bump locations
Alignment mark dimension and location
[2]
All information provided in this document is subject to legal disclaimers.
Figure
Figure 33
Rev. 03 — 5 October 2010
Bump
1
2
3
4
5
6
7
8
9
10
11
12
35).
and
y
Figure
y
−516.2
13 μm
x
34.
Figure 32
013aaa231
Coordinates
x
648.0
648.0
648.0
648.0
648.0
648.0
−648.0
−648.0
−648.0
−648.0
−648.0
−648.0
REF
and
Figure
SPI Real time clock/calendar
33.
y
−575.0
−377.0
−179.0
171.2
369.2
625.7
639.0
421.9
−25.9
−223.9
−441.0
−639.0
PCF2123
© NXP B.V. 2010. All rights reserved.
Figure
51 of 61
35)