PCF2123TS/1.118 NXP Semiconductors, PCF2123TS/1.118 Datasheet - Page 49

• Manufacturer Part Number: PCF2123TS/1.118
• Manufacturer: NXP Semiconductors

Specifications of PCF2123TS/1.118

• Bus Type: Serial (3-Wire, SPI)
• Package Type: TSSOP
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Mounting: Surface Mount
• Date Format: DW:DM:M:Y
• Time Format: HH:MM:SS
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
Fig 33. Bare die outline of PCF2123U/12AA/1
PCF2123
Product data sheet
WLCSP12: wafer level chip size package; 12 bumps; 1.492 x 1.449 x 0.22 mm
Dimensions
Note
1. Dimension includes saw lane.
2. P
3. P
PCF2123U/12AA
mm
1
2
Unit
Outline
version
and P
and P
max
nom
min
3
4
: pad size.
: bump size.
0.22
A
0.018
0.015
0.012
A
1
e
0.2
A
10
11
12
IEC
- - -
2
7
8
9
1.492 1.449
D
(1)
E
(1)
1.296
0.198
JEDEC
e
x
All information provided in this document is subject to legal disclaimers.
- - -
0
detail Y
P
0.09
0
y
P
P
1
D
e
2
1
(2)
References
0.084
0.081
0.078
Rev. 03 — 5 October 2010
0
P
PC2123-1
2
(3)
P
P
0.09
4
3
(2)
JEITA
- - -
P
0.084
0.081
0.078
3
P
scale
4
0.5
(3)
Y
6
5
4
3
2
1
E
1 mm
detail X
A
A
SPI Real time clock/calendar
2
European
projection
A
1
X
PCF2123
© NXP B.V. 2010. All rights reserved.
PCF2123U/12AA
pcf2123u_12aa_do
Issue date
09-10-19
10-07-13
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