PCF2123TS/1.118 NXP Semiconductors, PCF2123TS/1.118 Datasheet - Page 46
PCF2123TS/1.118
Manufacturer Part Number
PCF2123TS/1.118
Description
Manufacturer
NXP Semiconductors
Datasheet
1.PCF2123TS1.118.pdf
(61 pages)
Specifications of PCF2123TS/1.118
Bus Type
Serial (3-Wire, SPI)
Package Type
TSSOP
Operating Supply Voltage (max)
5.5V
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Mounting
Surface Mount
Date Format
DW:DM:M:Y
Time Format
HH:MM:SS
Lead Free Status / RoHS Status
Compliant
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NXP Semiconductors
14. Package outline
Fig 30. Package outline SOT402-1 (TSSOP14) of PCF2123TS/1
PCF2123
Product data sheet
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT402-1
max.
1.1
A
0.15
0.05
A
1
0.95
0.80
14
A
1
2
y
IEC
0.25
Z
pin 1 index
A
e
3
D
0.30
0.19
b
p
All information provided in this document is subject to legal disclaimers.
MO-153
JEDEC
0.2
0.1
c
b
p
8
7
REFERENCES
D
5.1
4.9
Rev. 03 — 5 October 2010
0
(1)
w
M
E
4.5
4.3
(2)
JEITA
scale
0.65
2.5
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
L
1
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
SPI Real time clock/calendar
0.2
v
Q
A
(A )
0.13
3
w
X
θ
v
PCF2123
0.1
A
© NXP B.V. 2010. All rights reserved.
y
M
ISSUE DATE
A
99-12-27
03-02-18
0.72
0.38
Z
(1)
SOT402-1
8
0
θ
o
o
46 of 61
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