PCF2123TS/1.118 NXP Semiconductors, PCF2123TS/1.118 Datasheet - Page 48

• Manufacturer Part Number: PCF2123TS/1.118
• Manufacturer: NXP Semiconductors

Specifications of PCF2123TS/1.118

• Bus Type: Serial (3-Wire, SPI)
• Package Type: TSSOP
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Mounting: Surface Mount
• Date Format: DW:DM:M:Y
• Time Format: HH:MM:SS
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
15. Bare die outline
Fig 32. Bare die outline of PCF2123U/10AA/1
PCF2123
Product data sheet
Wire bond die; 12 bonding pads; 1.492 x 1.449 x 0.20 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Dimension includes saw lane
2. P
3. P
mm
PCF2123U/10
2
1
UNIT
VERSION
OUTLINE
and P
and P
nom
4
3
: passivation opening
: pad size
0.20
A
1.492
D
10
11
12
(1)
7
8
9
Table 46.
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip; see
Symbol
SDO
SDI
SCL
CLKOE
CLKOUT
V
OSCI
CE
OSCO
TEST
INT
V
IEC
DD
SS
1.449
E
x
(1)
0
0
y
e
1.296
D
D
e
D
Bonding pad locations
P
0.09
1
JEDEC
(2)
All information provided in this document is subject to legal disclaimers.
6
5
4
3
2
1
X
0.081
E
P
REFERENCES
2
(3)
Figure
Rev. 03 — 5 October 2010
Pad
1
2
3
4
5
6
7
8
9
10
11
12
P
0.09
3
(2)
32.
0.081
P
JEITA
4
(3)
A
0
scale
Coordinates
x
648.0
648.0
648.0
648.0
648.0
648.0
−648.0
−648.0
−648.0
−648.0
−648.0
−648.0
1 mm
PROJECTION
P
P
EUROPEAN
detail X
2
1
SPI Real time clock/calendar
P
4
P
3
y
−575.0
−377.0
−179.0
171.2
369.2
625.7
639.0
421.9
−25.9
−223.9
−441.0
−639.0
PCF2123
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
08-07-16
08-07-24
PCF2123U/10
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