PCF2123TS/1.118 NXP Semiconductors, PCF2123TS/1.118 Datasheet - Page 2

• Manufacturer Part Number: PCF2123TS/1.118
• Manufacturer: NXP Semiconductors

Specifications of PCF2123TS/1.118

• Bus Type: Serial (3-Wire, SPI)
• Package Type: TSSOP
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Mounting: Surface Mount
• Date Format: DW:DM:M:Y
• Time Format: HH:MM:SS
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
4. Ordering information
Table 1.
[1]
[2]
5. Marking
PCF2123
Product data sheet
Type number
PCF2123TS/1
PCF2123BS/1
PCF2123U/10AA/1
PCF2123U/12AA/1
PCF2123U/12HA/1
Sawn 6 inch wafer on Film Frame Carrier (FFC) for 6 inch wafer, see
Sawn 6 inch wafer with gold bumps on Film Frame Carrier (FFC) for 8 inch wafer, see
Ordering information
PCF2123U/10
Package
Name
TSSOP14
HVQFN16
PCF2123U/12AA
PCF2123U/12HA
Table 2.
Type number
PCF2123TS/1
PCF2123BS/1
PCF2123U/10AA/1
PCF2123U/12AA/1
PCF2123U/12HA/1
Marking codes
All information provided in this document is subject to legal disclaimers.
Description
plastic thin shrink small outline package;
14 leads; body width 4.4 mm
plastic thermal enhanced very thin quad flat package;
no leads; 16 terminals; body 3 × 3 × 0.85 mm
wire bond die; 12 bonding pads;
1.492 × 1.449 × 0.20 mm
WLCSP12; wafer level chip size package; 12 bumps;
1.492 × 1.449 × 0.22 mm
WLCSP12; wafer level chip size package; 12 bumps;
1.492 × 1.449 × 0.17 mm
Rev. 03 — 5 October 2010
Figure 37 on page
[1]
[2]
[2]
Marking code
PCF2123
123
PC2123-1
PC2123-1
PC2123-1
Figure 38 on page
53.
SPI Real time clock/calendar
53.
PCF2123
© NXP B.V. 2010. All rights reserved.
Version
SOT402-1
SOT758-1
PCF2123U/10
PCF2123U/12AA
PCF2123U/12HA
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