BUT12AX,127 NXP Semiconductors, BUT12AX,127 Datasheet

no-image

BUT12AX,127

Manufacturer Part Number
BUT12AX,127
Description
TRANS NPN 1000V 8A TO-220F
Manufacturer
NXP Semiconductors
Datasheet
1.BUT12AX127.pdf (12 pages)

Specifications of BUT12AX,127

Transistor Type
NPN
Current - Collector (ic) (max)
8A
Voltage - Collector Emitter Breakdown (max)
450V
Vce Saturation (max) @ Ib, Ic
1.5V @ 1A, 5A
Current - Collector Cutoff (max)
1mA
Dc Current Gain (hfe) (min) @ Ic, Vce
10 @ 1A, 5V
Power - Max
23W
Mounting Type
Through Hole
Package / Case
TO-220-3 Full Pack
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Frequency - Transition
-
Other names
934057858127
BUT12AX
BUT12AX
1. Product profile
2. Pinning information
Table 1:
Pin
1
2
3
mb
Pinning - SOT186A (TO-220F), simplified outline and symbol
M3D308
Description
base (b)
collector (c)
emitter (e)
mounting base;
isolated
1.1 Description
1.2 Features
1.3 Applications
1.4 Quick reference data
High voltage, high speed, NPN power transistor in a plastic package.
BUT12AX
Silicon diffused power transistor
Rev. 01 — 16 June 2004
Isolated package
Inverters
Motor control systems
V
P
CESM
tot
23 W
1000 V
Simplified outline
SOT186A (TO-220F)
mb
1
2 3
MBK110
Symbol
Fast switching.
Switching regulators
DC-to-DC converters.
I
t
C
f
0.8 s.
8 A
MBB008
1
3
2
Product data

Related parts for BUT12AX,127

Image
Part Number
Description
Manufacturer
Datasheet
Request R
BUT12AX-01
Part Number:
BUT12AX-01
Description:
But12ax Silicon Diffused Power Transistor
Manufacturer:
NXP Semiconductors
Datasheet:
BUT12AX-01.pdf (12 pages)
LPC2420_60
Part Number:
LPC2420_60
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2420_60.pdf (86 pages)
LPC2458
Part Number:
LPC2458
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2458.pdf (80 pages)
LPC2468
Part Number:
LPC2468
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2468.pdf (85 pages)
LPC2470
Part Number:
LPC2470
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2470.pdf (91 pages)
LPC2478
Part Number:
LPC2478
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2478.pdf (93 pages)
XA-G30
Part Number:
XA-G30
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
XA-G30.pdf (36 pages)
XA-G37
Part Number:
XA-G37
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
XA-G37.pdf (37 pages)
XA-S3
Part Number:
XA-S3
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
XA-S3.pdf (52 pages)
LH75401_LH75411_N
Part Number:
LH75401_LH75411_N
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
LH75401_LH75411_N.pdf (63 pages)
LPC3130_3131
Part Number:
LPC3130_3131
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
LPC3130_3131.pdf (68 pages)
LPC3141FET180
Part Number:
LPC3141FET180
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3143FET180
Part Number:
LPC3143FET180
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3152FET208
Part Number:
LPC3152FET208
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3154FET208
Part Number:
LPC3154FET208
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors

BUT12AX,127 Summary of contents

Page 1

M3D308 1. Product profile 1.1 Description High voltage, high speed, NPN power transistor in a plastic package. 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information Table 1: Pinning - SOT186A (TO-220F), simplified outline and symbol Pin Description ...

Page 2

Philips Semiconductors 3. Ordering information Table 2: Ordering information Type number Package Name BUT12AX TO-220F 4. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V peak collector-emitter voltage CESM V ...

Page 3

Philips Semiconductors 120 P der (%) 100 P tot ---------------------- - P = 100% der P tot 25 C Fig 1. Normalized total power dissipation as a function of heatsink temperature ...

Page 4

Philips Semiconductors 5. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter R thermal resistance from junction to heatsink th(j-h) R thermal resistance from junction to ambient th(j-a) [1] External heatsink connected to mounting base. 6. Characteristics Table 5: Characteristics T ...

Page 5

Philips Semiconductors 2.0 V BEsat (V) 1.5 1 ˚ 100 ˚C 0 and 100 C j Fig 4. Base-emitter saturation voltage as a function of ...

Page 6

Philips Semiconductors and Fig 8. DC current gain as a function of collector current; typical values. 9397 750 13442 Product data ...

Page 7

Philips Semiconductors L 300 Fig 9. Test circuit for collector-emitter sustaining voltage 250 ...

Page 8

Philips Semiconductors 1000 200 Fig 13. Test ...

Page 9

Philips Semiconductors 8. Package outline Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3 lead TO-220 'full pack DIMENSIONS (mm are the original dimensions UNIT ...

Page 10

Philips Semiconductors 9. Revision history Table 7: Revision history Rev Date CPCN Description 01 20040616 - Product data (9397 750 13442) 9397 750 13442 Product data Rev. 01 — 16 June 2004 BUT12AX Silicon diffused power transistor © Koninklijke Philips ...

Page 11

Philips Semiconductors Philips Semiconductors 10. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing ...

Page 12

Philips Semiconductors Contents 1 Product profi 1.1 Description . . . . . ...

Related keywords