PBHV9040Z,115 NXP Semiconductors, PBHV9040Z,115 Datasheet

TRANS PNP 0.25A 500V SOT223

PBHV9040Z,115

Manufacturer Part Number
PBHV9040Z,115
Description
TRANS PNP 0.25A 500V SOT223
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PBHV9040Z,115

Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Mounting Type
Surface Mount
Power - Max
1.4W
Current - Collector (ic) (max)
250mA
Voltage - Collector Emitter Breakdown (max)
400V
Transistor Type
PNP
Current - Collector Cutoff (max)
100nA
Frequency - Transition
55MHz
Dc Current Gain (hfe) (min) @ Ic, Vce
80 @ 100mA, 10V
Vce Saturation (max) @ Ib, Ic
200mV @ 20mA, 100mA
Dc Collector/base Gain Hfe Min
100
Minimum Operating Temperature
- 55 C
Configuration
Dual
Transistor Polarity
PNP
Mounting Style
SMD/SMT
Collector- Emitter Voltage Vceo Max
- 400 V
Emitter- Base Voltage Vebo
- 6 V
Continuous Collector Current
- 250 mA
Maximum Dc Collector Current
- 500 mA
Power Dissipation
700 mW
Maximum Operating Frequency
55 MHz
Maximum Operating Temperature
+ 150 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934061409115::PBHV9040Z T/R::PBHV9040Z T/R
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
PNP high-voltage low V
SOT223 (SC-73) medium power Surface-Mounted Device (SMD) plastic package.
NPN complement: PBHV8540Z.
I
I
I
I
I
I
I
I
I
I
I
I
Table 1.
Symbol
V
V
I
h
C
FE
CESM
CEO
PBHV9040Z
500 V, 0.25 A PNP high-voltage low V
Rev. 02 — 15 January 2009
High voltage
Low collector-emitter saturation voltage V
High collector current capability I
High collector current gain (h
AEC-Q101 qualified
Electronic ballast for fluorescent lighting
LED driver for LED chain module
LCD backlighting
High Intensity Discharge (HID) front lighting
Automotive motor management
Hook switch for wired telecom
Switch mode power supply
Quick reference data
Parameter
collector-emitter peak
voltage
collector-emitter voltage
collector current
DC current gain
CEsat
Breakthrough In Small Signal (BISS) transistor in a
FE
) at high I
C
and I
Conditions
V
open base
V
I
C
BE
CE
= 50 mA
= 0 V
CM
= 10 V;
C
CEsat
CEsat
(BISS) transistor
Min
-
-
-
100
Product data sheet
Typ
-
-
-
200
Max
-
500
400
0.25 A
Unit
V
V

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PBHV9040Z,115 Summary of contents

Page 1

PBHV9040Z 500 V, 0.25 A PNP high-voltage low V Rev. 02 — 15 January 2009 1. Product profile 1.1 General description PNP high-voltage low V SOT223 (SC-73) medium power Surface-Mounted Device (SMD) plastic package. NPN complement: PBHV8540Z. 1.2 Features I ...

Page 2

... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PBHV9040Z 4. Marking Table 4. Type number PBHV9040Z PBHV9040Z_2 Product data sheet 500 V, 0.25 A PNP high-voltage low V Pinning Description base collector emitter collector Ordering information Package Name Description SC-73 plastic surface-mounted package with increased heatsink ...

Page 3

... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V CESM V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm ...

Page 4

... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector th(j-a) (K/W) duty cycle = 1 2 0.75 10 0.5 0.33 0.2 ...

Page 5

... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol I CBO I CES I EBO CEsat V BEsat off [1] Pulse test: t PBHV9040Z_2 Product data sheet 500 V, 0.25 A PNP high-voltage low V Characteristics Parameter Conditions collector-base cut-off V = 320 current V = 320 150 C j collector-emitter V = 320 cut-off current ...

Page 6

... NXP Semiconductors 400 h FE 300 (1) (2) 200 (3) 100 ( 100 C amb ( amb ( amb Fig 4. DC current gain as a function of collector current; typical values 1 (V) (1) 0.8 (2) ( amb ( amb ( 100 C amb Fig 6. Base-emitter voltage as a function of collector current; typical values PBHV9040Z_2 Product data sheet 500 V, 0 ...

Page 7

... NXP Semiconductors 10 V CEsat (V) 1 ( 100 C amb ( amb ( amb Fig 8. Collector-emitter saturation voltage as a function of collector current; typical values CEsat ( ) ( 100 C amb ( amb ( amb Fig 10. Collector-emitter saturation resistance as a function of collector current; typical values PBHV9040Z_2 Product data sheet 500 V, 0.25 A PNP high-voltage low V ...

Page 8

... NXP Semiconductors 8. Test information Fig 12. Test circuit for switching times 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors , and is suitable for use in automotive applications. ...

Page 9

... NXP Semiconductors 11. Soldering 1.3 1 Fig 14. Reflow soldering footprint SOT223 (SC-73) 1.9 Fig 15. Wave soldering footprint SOT223 (SC-73) PBHV9040Z_2 Product data sheet 500 V, 0.25 A PNP high-voltage low V 7 3.85 3.6 3.5 0 2.3 2 6.15 8.9 6 2.7 2.7 1.9 1 ...

Page 10

... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date PBHV9040Z_2 20090115 • Modifications: Table • Table • Section 13 “Legal PBHV9040Z_1 20080219 PBHV9040Z_2 Product data sheet 500 V, 0.25 A PNP high-voltage low V Data sheet status Product data sheet 5: I value changed from 100 mA to 200 mA ...

Page 11

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 12

... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering ...

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