MT48LC16M16A2P-75 IT:D TR Micron Technology Inc, MT48LC16M16A2P-75 IT:D TR Datasheet - Page 27
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MT48LC16M16A2P-75 IT:D TR
Manufacturer Part Number
MT48LC16M16A2P-75 IT:D TR
Description
DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II T/R
Manufacturer
Micron Technology Inc
Type
SDRAMr
Specifications of MT48LC16M16A2P-75 IT:D TR
Density
256 Mb
Maximum Clock Rate
133 MHz
Package
54TSOP-II
Address Bus Width
15 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
-40 to 85 °C
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
256M (16Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Package / Case
54-TSOP II
Organization
16Mx16
Address Bus
15b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant
Other names
557-1058-2
Table 13: Electrical Characteristics and Recommended AC Operating Conditions (-7E, -75)
Notes 1, 2, 4, 5, 7, and 20 apply to all parameters and conditions
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
Parameter
Access time from CLK (positive edge)
Address hold time
Address setup time
CLK high-level width
CLK low-level width
Clock cycle time
CKE hold time
CKE setup time
CS#, RAS#, CAS#, WE#, DQM hold time
CS#, RAS#, CAS#, WE#, DQM setup time
Data-in hold time
Data-in setup time
Data-out High-Z time
Data-out Low-Z time
Data-out hold time (load)
Data-out hold time (no load)
ACTIVE-to-PRECHARGE command
ACTIVE-to-ACTIVE command period
ACTIVE-to-READ or WRITE delay
Refresh period (8192 rows)
Refresh period – automotive (8192 rows)
AUTO REFRESH period
PRECHARGE command period
ACTIVE bank a to ACTIVE bank b command
Transition time
WRITE recovery time
Exit SELF REFRESH-to-ACTIVE command
CL = 3
CL = 2
CL = 3
CL = 2
CL = 3
CL = 2
Electrical Specifications – AC Operating Conditions
27
Symbol
t
t
t
t
t
t
t
t
t
AC(3)
AC(2)
t
t
REF
CK(3)
CK(2)
HZ(3)
HZ(2)
t
t
t
t
t
t
CMH
t
t
CMS
t
OHn
t
CKH
t
RCD
RRD
t
t
t
RAS
t
t
CKS
RFC
t
XSR
t
REF
WR
AH
DH
OH
CH
AS
DS
RC
CL
LZ
RP
t
T
AT
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1 CLK
+ 7ns
Min
0.8
1.5
2.5
2.5
7.5
0.8
1.5
0.8
1.5
0.8
1.5
1.8
0.3
37
60
15
66
15
14
14
67
–
–
7
–
–
1
3
–
–
-7E
256Mb: x4, x8, x16 SDRAM
120,0
Max
5.4
5.4
5.4
5.4
1.2
00
64
16
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
1 CLK
7.5ns
Min
0.8
1.5
2.5
2.5
7.5
0.8
1.5
0.8
1.5
0.8
1.5
1.8
0.3
10
44
66
20
66
20
15
15
75
1
3
+
–
–
–
–
–
–
© 1999 Micron Technology, Inc. All rights reserved.
-75
120,0
Max
5.4
5.4
1.2
00
64
16
6
–
–
–
–
–
–
–
–
–
–
–
–
6
–
–
–
–
–
–
–
–
–
–
–
Unit
t
ms
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CK
ns
ns
ns
Notes
18
14
21
19
15
16
12
6
3