MT48LC16M16A2P-75 IT:D TR Micron Technology Inc, MT48LC16M16A2P-75 IT:D TR Datasheet - Page 20
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MT48LC16M16A2P-75 IT:D TR
Manufacturer Part Number
MT48LC16M16A2P-75 IT:D TR
Description
DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II T/R
Manufacturer
Micron Technology Inc
Type
SDRAMr
Specifications of MT48LC16M16A2P-75 IT:D TR
Density
256 Mb
Maximum Clock Rate
133 MHz
Package
54TSOP-II
Address Bus Width
15 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
-40 to 85 °C
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
256M (16Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Package / Case
54-TSOP II
Organization
16Mx16
Address Bus
15b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant
Other names
557-1058-2
Table 6: Thermal Impedance Simulated Values
Figure 10: Example: Temperature Test Point Location, 54-Pin TSOP (Top View)
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
Revision
Die
D
54-ball VFBGA
Test point
60-ball FBGA
54-pin TSOP
Package
Notes:
Substrate
1. For designs expected to last beyond the die revision listed, contact Micron Applications
2. Thermal resistance data is sampled from multiple lots, and the values should be viewed
3. These are estimates; actual results may vary.
2-layer
4-layer
2-layer
4-layer
2-layer
4-layer
Engineering to confirm thermal impedance values.
as typical.
11.11mm
Θ JA (°C/W)
Airflow =
0m/s
64.9
51.5
40.9
81
44
67
22.22mm
20
Θ JA (°C/W)
Airflow =
Temperature and Thermal Impedance
1m/s
63.8
47.3
50.8
41.6
51.2
35.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Θ JA (°C/W)
Airflow =
256Mb: x4, x8, x16 SDRAM
2m/s
57.6
44.5
44.8
38.1
47.8
32.2
5.08mm
© 1999 Micron Technology, Inc. All rights reserved.
Θ JB (°C/W) Θ JC (°C/W)
10.16mm
45.3
39.1
31.4
31.4
19.7
18.6
10.3
3.2
6.7