IPD16CNE8N G Infineon Technologies, IPD16CNE8N G Datasheet

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IPD16CNE8N G

Manufacturer Part Number
IPD16CNE8N G
Description
MOSFET N-CH 85V 53A TO252-3
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of IPD16CNE8N G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
16 mOhm @ 53A, 10V
Drain To Source Voltage (vdss)
85V
Current - Continuous Drain (id) @ 25° C
53A
Vgs(th) (max) @ Id
4V @ 61µA
Gate Charge (qg) @ Vgs
48nC @ 10V
Input Capacitance (ciss) @ Vds
3230pF @ 40V
Power - Max
100W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SP000096455
Rev. 1.07
1)
2)
3)
Features
• N-channel, normal level
• Excellent gate charge x R
• Very low on-resistance R
• 175 °C operating temperature
• Pb-free lead plating; RoHS compliant
• Qualified according to JEDEC
• Ideal for high-frequency switching and synchronous rectification
• Halogen-free according to IEC61249-2-21 *
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Reverse diode dv /dt
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
OptiMOS
Type
Package
Marking
*
J-STD20 and JESD22
T
see figure 3
Except D-PAK ( TO-252 )
jmax
=150°C and duty cycle D=0.01 for Vgs<-5V
2 Power-Transistor
IPB16CNE8N G
PG-TO263-3
16CNE8N
2)
3)
j
=25 °C, unless otherwise specified
DS(on)
DS(on)
1)
product (FOM)
for target application
Symbol Conditions
I
I
E
dv /dt
V
P
T
D
D,pulse
j
AS
GS
tot
, T
IPD16CNE8N G
PG-TO252-3
16CNE8N
stg
T
T
T
I
I
di /dt =100 A/µs,
T
T
D
D
page 1
C
C
C
j,max
C
=53 A, R
=53 A, V
=25 °C
=100 °C
=25 °C
=25 °C
=175 °C
DS
GS
=68 V,
=25 Ω
Product Summary
V
R
I
IPI16CNE8N G
PG-TO262-3
16CNE8N
D
DS
DS(on),max
IPB16CNE8N G
IPI16CNE8N G
(TO252)
-55 ... 175
55/175/56
Value
212
107
±20
100
53
38
6
IPP16CNE8N G
PG-TO220-3
16CNE8N
IPD16CNE8N G
IPP16CNE8N G
85
16
53
Unit
A
mJ
kV/µs
V
W
°C
V
mΩ
A
2010-04-27

Related parts for IPD16CNE8N G

IPD16CNE8N G Summary of contents

Page 1

... =100 ° =25 °C D,pulse C =25 Ω = = = /dt di /dt =100 A/µs, T =175 °C j,max =25 °C tot stg page 1 IPB16CNE8N G IPD16CNE8N G IPI16CNE8N G IPP16CNE8N (TO252) 16 mΩ IPP16CNE8N G PG-TO220-3 16CNE8N Value Unit 212 107 mJ 6 kV/µs ±20 V 100 W -55 ... 175 °C 55/175/56 2010-04-27 ...

Page 2

... V = =125 ° = GSS = = DS(on) (TO252 (TO263 (TO220, TO262 |>2 DS(on)max = (one layer, 70 µm thick) copper area for drain page 2 IPB16CNE8N G IPD16CNE8N G IPI16CNE8N G IPP16CNE8N G Values Unit min. typ. max 1.5 K 0.1 1 µ 100 - 1 100 nA - 12.2 16 mΩ - 12.4 16.2 - 12.7 16.5 Ω ...

Page 3

... Rev. 1.07 Symbol Conditions C iss = oss f =1 MHz C rss t d( =1.6 Ω I =26 d(off = = plateau oss =25 ° S,pulse = =25 ° = /dt =100 A/µ page 3 IPB16CNE8N G IPD16CNE8N G IPI16CNE8N G IPP16CNE8N G Values Unit min. typ. max. - 2430 3230 pF - 452 601 - 5 212 - 1 1 110 - ns - 210 - nC 2010-04-27 ...

Page 4

... Rev. 1.07 2 Drain current I =f 100 150 200 0 [° Max. transient thermal impedance Z =f(t thJC p parameter µs 10 µ 100 µ [V] DS page 4 IPB16CNE8N G IPD16CNE8N G IPI16CNE8N G IPP16CNE8N G ≥ 100 150 T [° 0.5 0.2 0.1 0.05 0.02 0.01 single pulse - [s] p 200 0 10 2010-04-27 ...

Page 5

... V 100 5 4 Typ. transfer characteristics I =f |>2 DS(on)max parameter 200 150 100 Rev. 1.07 6 Typ. drain-source on resistance R =f(I DS(on) parameter [ Typ. forward transconductance g =f 175 °C 25 ° [V] GS page 5 IPB16CNE8N G IPD16CNE8N G IPI16CNE8N G IPP16CNE8N =25 ° 4 5 [A] D =25 ° [ 2010-04-27 ...

Page 6

... GS(th) parameter 3.5 3 2.5 2 1.5 typ 1 0 100 140 180 -60 [° Forward characteristics of reverse diode I =f parameter [V] DS page 6 IPB16CNE8N G IPD16CNE8N G IPI16CNE8N G IPP16CNE8N 610 µA 61 µA - 100 140 T [° °C 175 °C 175 °C, 98% 25 °C, 98% 0.5 1 1.5 V [V] SD 180 2 2010-04-27 ...

Page 7

... AV 15 Drain-source breakdown voltage V =f BR(DSS 100 -60 - Rev. 1.07 14 Typ. gate charge V =f(Q GS gate parameter °C 8 100 ° 100 1000 0 [µs] 16 Gate charge waveforms s(th) Q g(th) 60 100 140 180 [°C] j page 7 IPB16CNE8N G IPD16CNE8N G IPI16CNE8N G IPP16CNE8N =53 A pulsed [nC] gate ate 2010-04-27 ...

Page 8

... PG-TO220-3: Outline Rev. 1.07 IPB16CNE8N G IPI16CNE8N G page 8 IPD16CNE8N G IPP16CNE8N G 2010-04-27 ...

Page 9

... PG-TO262-3-1 (I²PAK) Rev. 1.07 IPB16CNE8N G IPI16CNE8N G page 9 IPD16CNE8N G IPP16CNE8N G 2010-04-27 ...

Page 10

... PG-TO-263 (D²-Pak) Rev. 1.07 IPB16CNE8N G IPI16CNE8N G page 10 IPD16CNE8N G IPP16CNE8N G 2010-04-27 ...

Page 11

... PG-TO252-3: Outline Rev. 1.07 IPB16CNE8N G IPI16CNE8N G page 11 IPD16CNE8N G IPP16CNE8N G 2010-04-27 ...

Page 12

... Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.07 IPB16CNE8N G IPI16CNE8N G page 12 IPD16CNE8N G IPP16CNE8N G 2010-04-27 ...

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