FDMS2672 Fairchild Semiconductor, FDMS2672 Datasheet

FDMS2672

Manufacturer Part Number

FDMS2672

Description

MOSFET N-CH 200V 3.7A POWER56

Manufacturer

Fairchild Semiconductor

Series

UltraFET™r

Datasheet

1.FDMS2672.pdf (7 pages)

Specifications of FDMS2672

Fet Type

MOSFET N-Channel, Metal Oxide

Fet Feature

Logic Level Gate

Rds On (max) @ Id, Vgs

77 mOhm @ 3.7A, 10V

Drain To Source Voltage (vdss)

200V

Current - Continuous Drain (id) @ 25° C

3.7A

Vgs(th) (max) @ Id

4V @ 250µA

Gate Charge (qg) @ Vgs

42nC @ 10V

Input Capacitance (ciss) @ Vds

2315pF @ 100V

Power - Max

2.5W

Mounting Type

Surface Mount

Package / Case

8-MLP, Power56

Configuration

Single Quad Drain Triple Source

Transistor Polarity

N-Channel

Resistance Drain-source Rds (on)

77 mOhms

Forward Transconductance Gfs (max / Min)

14 S

Drain-source Breakdown Voltage

200 V

Gate-source Breakdown Voltage

+/- 20 V

Continuous Drain Current

20 A

Power Dissipation

2.5 W

Maximum Operating Temperature

+ 150 C

Mounting Style

SMD/SMT

Minimum Operating Temperature

- 55 C

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

FDMS2672TR

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

viewing upon request.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Ti, CS

E-mail: CS.Ti@fairchildsemi.com

Phone: 604-6437211 ext 685

Implementation of change:

Expected 1st Device Shipment Date: 2007/10/01

Earliest Year/Work Week of Changed Product: H2

Change Type Description: Bond Wire Material Composition

Description of Change (From): Wire bond material currently used for our MLP 5x6 discrete

products assembled from Fairchild (M), FSPM facility will be changed from Au wire to Cu

wire. Package with this change will have an identifier. There will be no change in terms of wire

diamter and type of thermosonic bonding process applied.

Description of Change (To): From Au wire used in MLP 5x6 Discrete products to Cu wire

Reason for Change : Change from Au wire to Cu wire a more robust wire bonding process.

There will be no adverse impact on products' quality and reliability. Products will be assembled

at the same quality level as before.

Qual/REL Plan Numbers : Q20060405

Qualification :

Project Qualification of Penang 5X6 MLP with 2 mil Cu wire Conclusion All reliability

tests outlined in Q20060405 qualification plan were completed successfully with no

failure and meet the requirements for release. As such, FSPM MLP 5*6 8L is qualified.

Results/Discussion

Test: (Autoclave)

Lot

Q20060405AAACLV

Q20060405ABACLV

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

Technical Contact:

Name: Ti, CS

E-mail: CS.Ti@fairchildsemi.com

Phone: 604-6437211 ext 685

Device

FDMS8690

96-HOURS

0/79

Date Issued On : 2007/08/22

Date Created : 2007/08/14

Failure Code

PCN# : Q1070501-C

Pg. 1

Related parts for FDMS2672

FDMS2672 Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Q20060405ACACLV FDMS8690 Q20060405ADACLV FDMS8690 Q20060405BAACLV FDMS2572 Test: (High Temperature Gate Bias) Lot Device Q20060405AAHTGB FDMS8690 Q20060405ABHTGB Q20060405ACHTGB Q20060405ADHTGB Q20060405BAHTGB FDMS2572 Test: (High Temperature Reverse Bias) Lot Device Q20060405AAHTRB FDMS8690 Q20060405ABHTRB Q20060405ACHTRB Q20060405ADHTRB Q20060405BAHTRB FDMS2572 Test: (High Temperature Storage Life) Lot ...

Page 3

... Q20060405BAHAST1 FDMS2572 Test: MSL(1), PKG(Small), PeakTemp(260c), Cycles(3) (Precondition) Lot Device Q20060405AAPCNL1A FDMS8690 Q20060405ABPCNL1A FDMS8690 Q20060405ACPCNL1A FDMS8690 Q20060405ADPCNL1A FDMS8690 Q20060405BAPCNL1A FDMS2572 Product Id Description : Affected FSIDs : FDMS2672 100-CYCLES 500-CYCLES 0/79 0/79 0/79 0/79 0/79 0/79 0/79 0/79 0/79 0/79 96-HOURS 0/79 0/79 0/79 ...

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