WM8196SCDS Wolfson Microelectronics, WM8196SCDS Datasheet - Page 5

• Manufacturer Part Number: WM8196SCDS
• Description: Video ICs 16-Bit 12MSPS 3-Channel AFE
• Manufacturer: Wolfson Microelectronics
• Type: CCD/CISr

Specifications of WM8196SCDS

• Operating Supply Voltage: 3.3 V or 5 V
• Supply Current: 60 mA
• Maximum Operating Temperature: + 70 C
• Package / Case: SSOP-28
• Conversion Rate: 12000 KSPS
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Number Of Channels: 3
• Resolution: 16 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

WM8196
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at
or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical
Characteristics at the test conditions specified.
Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage
conditions prior to surface mount assembly. These levels are:
MSL1 = unlimited floor life at <30°C / 85% Relative Humidity. Not normally stored in moisture barrier bag.
MSL2 = out of bag storage for 1 year at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.
MSL3 = out of bag storage for 168 hours at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.
The Moisture Sensitivity Level for each package type is specified in Ordering Information.
Notes:
1.
2.
RECOMMENDED OPERATING CONDITIONS
THERMAL PERFORMANCE
Notes:
1.
w
CONDITION
Analogue supply voltage: AVDD
Digital supply voltages: DVDD1 − 2
Digital ground: DGND
Analogue grounds: AGND1 − 2
Digital inputs, digital outputs and digital I/O pins
Analogue inputs (RINP, GINP, BINP)
Other pins
Operating temperature range: T
Storage temperature prior to soldering
Storage temperature after soldering
CONDITION
Operating temperature range
Analogue supply voltage
Digital core supply voltage
Digital I/O supply voltage
PARAMETER
Performance
Thermal resistance – junction to
case
Thermal resistance – junction to
ambient
Figures given are for package mounted on 4-layer FR4 according to JESD51-5 and JESD51-7.
GND denotes the voltage of any ground pin.
AGND1, AGND2 and DGND pins are intended to be operated at the same potential. Differential voltages
between these pins will degrade performance.
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible
to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage
of this device.
A
5V I/O
3.3V I/O
SYMBOL
R
R
θJC
θJA
SYMBOL
DVDD1
DVDD2
DVDD2
TEST CONDITIONS
AVDD
T
T
A
ambient
= 25°C
4.75
4.75
4.75
2.97
MIN
GND - 0.3V
GND - 0.3V
GND - 0.3V
GND - 0.3V
GND - 0.3V
GND - 0.3V
GND - 0.3V
0
-65 ° C
MIN
0 ° C
MIN
30 ° C max / 85% RH max
TYP
5.0
5.0
5.0
3.3
23.9
67.1
TYP
DVDD2 + 0.3V
AVDD + 0.3V
AVDD + 0.3V
MAX
5.25
5.25
5.25
3.63
GND + 0.3V
GND + 0.3V
70
GND + 7V
GND + 7V
PD Rev 4.3 March 2007
+150 ° C
MAX
MAX
+70 ° C
Production Data
UNITS
°C/W
°C/W
UNIT
°C
V
V
V
V
5