FDFMA2P029Z Fairchild Semiconductor, FDFMA2P029Z Datasheet - Page 3

MOSFET P-CH 20V 3.1A 2X2MLP

FDFMA2P029Z

Manufacturer Part Number
FDFMA2P029Z
Description
MOSFET P-CH 20V 3.1A 2X2MLP
Manufacturer
Fairchild Semiconductor
Series
PowerTrench®r
Datasheet

Specifications of FDFMA2P029Z

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Diode (Isolated)
Rds On (max) @ Id, Vgs
95 mOhm @ 3.1A, 4.5V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
3.1A
Vgs(th) (max) @ Id
1.5V @ 250µA
Gate Charge (qg) @ Vgs
10nC @ 4.5V
Input Capacitance (ciss) @ Vds
720pF @ 10V
Power - Max
700mW
Mounting Type
Surface Mount
Package / Case
6-MLP, 6-MicroFET™
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
FDFMA2P029ZTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FDFMA2P029Z
Manufacturer:
Fairchild Semiconductor
Quantity:
41 800
FDFMA2P029Z Rev.B1
Notes:
1: R
2: Pulse Test : Pulse Width < 300us, Duty Cycle < 2.0%
3. The diode connected between the gate and source serves only protection against ESD. No gate overvoltage rating is implied.
user's board design.
(a) MOSFET R
(b) MOSFET R
(c) Schottky R
(d) Schottky R
TJA
is determined with the device mounted on a 1 in
TJA
TJA
TJA
TJA
= 86
= 140
= 86°C/W when mounted on a 1in
= 173°C/W when mounted on a minimum pad of 2 oz copper
o
C/W when mounted on a 1in
o
C/W when mounted on a minimum pad of 2 oz copper.
a)86
when mounted
on a 1in
2 oz copper.
o
C/W
2
pad of
2
2
2
pad of 2 oz copper, 1.5” x 1.5” x 0.062” thick PCB.
oz. copper pad on a 1.5 x 1.5 in. board of FR-4 material. R
pad of 2 oz copper, 1.5" x 1.5" x 0.062" thick PCB
b)173
when mounted
on a minimum
pad of 2 oz
copper.
o
C/W
3
TJC
c)86
mounted on a
1in
copper.
is guaranteed by design while R
2
o
pad of 2 oz
C/W when
TJA
is determined by the
www.fairchildsemi.com
d)140
when mounted
on a minimum
pad of 2 oz
copper.
o
C/W

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