FDMA520PZ Fairchild Semiconductor, FDMA520PZ Datasheet

MOSFET P-CH 20V 7.3A MLP2X2

FDMA520PZ

Manufacturer Part Number
FDMA520PZ
Description
MOSFET P-CH 20V 7.3A MLP2X2
Manufacturer
Fairchild Semiconductor
Series
PowerTrench®r
Datasheet

Specifications of FDMA520PZ

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
30 mOhm @ 7.3A, 4.5V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
7.3A
Vgs(th) (max) @ Id
1.5V @ 250µA
Gate Charge (qg) @ Vgs
20nC @ 4.5V
Input Capacitance (ciss) @ Vds
1645pF @ 10V
Power - Max
900mW
Mounting Type
Surface Mount
Package / Case
6-MLP, 6-MicroFET™
Transistor Polarity
P Channel
Continuous Drain Current Id
7.3A
Drain Source Voltage Vds
20V
On Resistance Rds(on)
30mohm
Rds(on) Test Voltage Vgs
12V
Threshold Voltage Vgs Typ
-1.1V
Rohs Compliant
Yes
Configuration
Single Quad Drain
Resistance Drain-source Rds (on)
30 mOhms
Forward Transconductance Gfs (max / Min)
22 S
Drain-source Breakdown Voltage
- 20 V
Gate-source Breakdown Voltage
+/- 12 V
Continuous Drain Current
7.3 A
Power Dissipation
2.4 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
FDMA520PZTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FDMA520PZ
Manufacturer:
FSC
Quantity:
12 400
Part Number:
FDMA520PZ
Manufacturer:
ST
0
Part Number:
FDMA520PZ
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
©2009 Fairchild Semiconductor Corporation
FDMA520PZ Rev.B2
MOSFET Maximum Ratings
Thermal Characteristics
Package Marking and Ordering Information
FDMA520PZ
Single P-Channel PowerTrench
–20V, –7.3A, 30m
Features
V
V
I
P
T
R
R
D
J
DS
GS
D
Max r
Max r
Low profile - 0.8mm maximum - in the new package MicroFET
2X2 mm
Free from halogenated compounds and antimony oxides
RoHS Compliant
HBM ESD protection level > 3k V typical (Note 3)
, T
JA
JA
Symbol
Device Marking
STG
DS(on)
DS(on)
520
Drain
= 30m at V
= 53m at V
Pin 1
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Power Dissipation
Power Dissipation
Operating and Storage Junction Temperature Range
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
MicroFET 2X2 (Bottom View)
D
GS
GS
= –4.5V, I
= –2.5V, I
D
D
FDMA520PZ
-Continuous
-Pulsed
Device
D
S
D
D
= –7.3A
= –5.5A
G
T
A
= 25°C unless otherwise noted
Parameter
Source
MicroFET 2X2
Package
®
MOSFET
1
General Description
This device is designed specifically for battery charge or load
switching in cellular handset and other ultraportable applications.
It features a MOSFET with low on-state resistance.
The MicroFET 2X2 package offers exceptional thermal
performance for its physical size and is well suited to linear mode
applications.
G
D
D
Reel Size
1
2
3
7’’
Bottom Drain Contact
(Note 1a)
(Note 1a)
(Note 1b)
(Note 1a)
(Note 1b)
Tape Width
8mm
–55 to +150
Ratings
–7.3
–20
±12
145
–24
2.4
0.9
52
6
5
4
April 2009
D
D
www.fairchildsemi.com
S
3000 units
Quantity
Units
°C/W
°C
W
V
V
A
tm

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FDMA520PZ Summary of contents

Page 1

... Thermal Resistance, Junction to Ambient JA Package Marking and Ordering Information Device Marking Device 520 FDMA520PZ ©2009 Fairchild Semiconductor Corporation FDMA520PZ Rev.B2 ® MOSFET General Description = –7.3A This device is designed specifically for battery charge or load D switching in cellular handset and other ultraportable applications. = –5. features a MOSFET with low on-state resistance ...

Page 2

... JA a. 52°C/W when mounted Pulse Test: Pulse Width < 300 s, Duty cycle < 2.0%. 3: The diode connected between the gate and the source serves only as protection against ESD. No gate overvoltage rating is implied. FDMA520PZ Rev. 25°C unless otherwise noted J Test Conditions I = – ...

Page 3

... T , JUNCTION TEMPERATURE J Figure 3. Normalized On- Resistance vs Junction Temperature 24 PULSE DURATION = 80 s DUTY CYCLE = 0.5%MAX - 125 GATE TO SOURCE VOLTAGE (V) GS Figure 5. Transfer Characteristics FDMA520PZ Rev. 25°C unless otherwise noted J PULSE DURATION = 80 s DUTY CYCLE = 0.5%MAX V = -2. 100 125 150 ( 0.001 0.0001 ...

Page 4

... GS 1E 125 C J 1E-6 1E 1E-8 1E GATE TO SOURCE VOLTAGE(V) GS Figure 9. Gate Leakage Current vs Gate to Source Voltage 150 120 PULSE WIDTH (s) Figure 11. Single Pulse Maximum Power Dissipation FDMA520PZ Rev. 25°C unless otherwise noted J 3000 V = -5V DD 1000 V = -10V -15V SINGLE PULSE 145 C = 0.005 ...

Page 5

... Dimensional Outline and Pad Layout FDMA520PZ Rev.B2 5 www.fairchildsemi.com ...

Page 6

... Definition of Terms Datasheet Identification Product Status Advance Information Formative / In Design Preliminary First Production No Identification Needed Full Production Obsolete Not In Production FDMA520PZ Rev. B2 F-PFS™ PowerTrench ® FRFET PowerXS™ SM Global Power Resource Programmable Active Droop™ ® Green FPS™ QFET Green FPS™ ...

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