FDMS2572 Fairchild Semiconductor, FDMS2572 Datasheet

FDMS2572

Manufacturer Part Number

FDMS2572

Description

MOSFET N-CH 150V 4.5A POWER56

Manufacturer

Fairchild Semiconductor

Series

UltraFET™r

Datasheet

1.FDMS2572.pdf (7 pages)

Specifications of FDMS2572

Fet Type

MOSFET N-Channel, Metal Oxide

Fet Feature

Logic Level Gate

Rds On (max) @ Id, Vgs

47 mOhm @ 4.5A, 10V

Drain To Source Voltage (vdss)

150V

Current - Continuous Drain (id) @ 25° C

4.5A

Vgs(th) (max) @ Id

4V @ 250µA

Gate Charge (qg) @ Vgs

43nC @ 10V

Input Capacitance (ciss) @ Vds

2610pF @ 75V

Power - Max

2.5W

Mounting Type

Surface Mount

Package / Case

8-MLP, Power56

Configuration

Single Quad Drain Triple Source

Transistor Polarity

N-Channel

Resistance Drain-source Rds (on)

0.036 Ohms

Forward Transconductance Gfs (max / Min)

14 S

Drain-source Breakdown Voltage

150 V

Gate-source Breakdown Voltage

+/- 20 V

Continuous Drain Current

4.5 A

Power Dissipation

2.5 W

Maximum Operating Temperature

+ 150 C

Mounting Style

SMD/SMT

Minimum Operating Temperature

- 55 C

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

FDMS2572TR

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MLP 5x6 Discrete Cu Wire Conversion

This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence. This is a preliminary

notification. A Final PCN will be issued when qualification is complete and data is available.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Ti, CS

E-mail: CS.Ti@fairchildsemi.com

Phone: 604-6437211 ext 685

Implementation of change:

Expected 1st Device Shipment Date: 2007/06/01

Earliest Year/Work Week of Changed Product: H2

Change Type Description: Bond Wire Material Composition

Description of Change (From): Wire bond material currently used for our MLP 5x6 discrete

products assembled from Fairchild (M), FSPm facility will be changed from Au wire to Cu

wire. Package with this change will have an identifier. There will be no change in terms of wire

diamter and type of thermosonic bonding process applied.

Description of Change (To): From Au wire used in MLP 5x6 Discrete products to Cu wire

Reason for Change : Change from Au wire to Cu wire is to enhance RDSon performance. Cu

wire use in place of Au will result in lower RDSon. There will be no adverse impact on

products' quality and reliability. Products will be assembled at the same quality level as before.

Qual/REL Plan Numbers : Q20060405

Qualification Plan covers all biased and non-biased stresses and assembly level

reliability data (wire pull, ball shear, bond and weld formations, craters). Please refer to

qualification plan attached for details.

Qualification :

Qualification Plan covers all biased and non-biased stresses and assembly level

reliability data (wire pull, ball shear, bond and weld formations, craters). Please refer to

qualification plan attached for details.

Technical Contact:

Name: Ti, CS

E-mail: CS.Ti@fairchildsemi.com

Phone: 604-6437211 ext 685

Qualification Stress Test and Sample Size Detail

FORECAST CHANGE NOTIFICATION

Date Issued On : 2007/03/05

Date Created : 2007/01/31

PCN# : Q1070501

Pg. 1

Related parts for FDMS2572

FDMS2572 Summary of contents

Page 1

... This notification is for your information and concurrence. This is a preliminary notification. A Final PCN will be issued when qualification is complete and data is available. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. If you have any questions concerning this change, please contact: ...

Page 2

... TMCL1 X JESD22-A104 -65C, 150C Product Id Description : This change will affect certain products currently assembled in our MLP 5x6 packages from Fairchild (M), FSPM. Products affected by this change are listed in the Affected FSID List attached. Affected FSIDs : FDMS2572 FDMS8690 Conditions Readpoints Conditions TP1 TP2 ...

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