FDZ2554PZ Fairchild Semiconductor, FDZ2554PZ Datasheet
FDZ2554PZ
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FDZ2554PZ Summary of contents
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... R Thermal Resistance, Junction to Ball θJB Package Marking and Ordering Information Device Marking Device 2554P FDZ2554P ©2007 Fairchild Semiconductor Corporation FDZ2554P Rev B General Description = -6.5A Combining Fairchild’s advanced 2.5V specified PowerTrench D process with state-of-the-art BGA packaging, the FDZ2554P = -5A D minimizes both PCB space and r ...
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... defined for reference. For R θJB are guaranteed by design while R is determined by the user's board design. θJA 2. Pulse Test: Pulse Width < 300µs, Duty cycle < 2.0%. ©2007 Fairchild Semiconductor Corporation FDZ2554P Rev 25°C unless otherwise noted J Test Conditions I = -250µ ...
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... JUNCTION TEMPERATURE J Figure 3. Normalized On- Resistance vs Junction Temperature 20 µ PULSE DURATION = 300 DUTY CYCLE = 2.0%MAX =125 0.5 1.0 1 GATE TO SOURCE VOLTAGE (V) GS Figure 5. Transfer Characteristics ©2007 Fairchild Semiconductor Corporation FDZ2554P Rev 25°C unless otherwise noted -2V GS µ s 1.5 2.0 75 100 125 150 ...
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... DRAIN to SOURCE VOLTAGE (V) DS Figure 9. Forward Bias Safe Operating Area 2 1 DUTY CYCLE-DESCENDING ORDER D = 0.5 0.2 0.1 0.05 0.1 0.02 0.01 0.01 SINGLE PULSE 1E ©2007 Fairchild Semiconductor Corporation FDZ2554P Rev 25°C unless otherwise noted -10V -15V 3000 1000 1ms 10ms 100ms 1s 10s ...
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... Dimensional Outline and Pad Layout ©2007 Fairchild Semiconductor Corporation FDZ2554P Rev B 5 www.fairchildsemi.com ...
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... TRADEMARKS The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended exhaustive list of all such trademarks. ® ACEx Build it Now™ CorePLUS™ CROSSVOLT™ CTL™ Current Transfer Logic™ ® ...