FDS8333C Fairchild Semiconductor, FDS8333C Datasheet

MOSFET N/P-CH 30V 4.1/3.4A 8SOIC

FDS8333C

Manufacturer Part Number
FDS8333C
Description
MOSFET N/P-CH 30V 4.1/3.4A 8SOIC
Manufacturer
Fairchild Semiconductor
Series
PowerTrench®r
Datasheet

Specifications of FDS8333C

Fet Type
N and P-Channel
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
80 mOhm @ 4.1A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
4.1A, 3.4A
Vgs(th) (max) @ Id
3V @ 250µA
Gate Charge (qg) @ Vgs
6.6nC @ 4.5V
Input Capacitance (ciss) @ Vds
282pF @ 10V
Power - Max
900mW
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Configuration
Dual Dual Drain
Transistor Polarity
N and P-Channel
Resistance Drain-source Rds (on)
0.08 Ohm @ 10 V @ N Channel
Forward Transconductance Gfs (max / Min)
5 S
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 16 V @ N Channel or +/- 20 V @ P Channel
Continuous Drain Current
4.1 A @ N Channel or 3.4 A @ P Channel
Power Dissipation
2000 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FDS8333C
Manufacturer:
STM
Quantity:
7 013
Part Number:
FDS8333C
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
Part Number:
FDS8333C
Quantity:
5 000
Part Number:
FDS8333C-NL
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
2002 Fairchild Semiconductor Corporation
FDS8333C
30V N & P-Channel PowerTrench MOSFETs
General Description
These
produced using Fairchild Semiconductor’s
advanced PowerTrench process that has been
especially
resistance and yet maintain superior switching
performance.
These devices are well suited for low voltage
and battery powered applications where low
in-line power loss and fast switching are
required.
Absolute Maximum Ratings
Symbol
V
V
I
P
T
Thermal Characteristics
R
R
Package Marking and Ordering Information
D
D
J
DSS
GSS
, T
JA
J C
Device Marking
STG
FDS8333C
N
SO-8
tailored
&
Drain-Source Voltage
Gate-Source Voltage
Drain Current
Power Dissipation for Dual Operation
Power Dissipation for Single Operation
Operating and Storage Junction Temperature Range
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
P-Channel
to
D
D1
Pin 1
D
minimize
D1
SO-8
D
MOSFETs
D2
– Continuous
– Pulsed
D
FDS8333C
D2
Device
Parameter
on-state
S1
S
G1
S
are
S2
S
G2
G
T
A
=25
o
C unless otherwise noted
Reel Size
7’’
Features
(Note 1a)
(Note 1a)
(Note 1b)
(Note 1c)
(Note 1a)
(Note 1)
Q1
Q2
Low gate charge
High performance trench technology for extremely
low R
High power and handling capability in a widely used
surface mount package.
4.1 A, 30V. R
–3.4 A, 30V. R
DS(ON)
.
5
6
7
8
Q1
4.1
30
20
16
Tape width
–55 to +150
12mm
Q2
Q1
R
R
DS(ON)
DS(ON)
DS(ON)
DS(ON)
1.6
0.9
78
40
2
1
= 80 m @ V
= 130 m @ V
= 130 m @ V
= 200 m @ V
–3.4
Q2
–30
–20
20
4
3
2
1
August 2002
2500 units
Quantity
FDS8333C Rev C (W)
GS
GS
GS
GS
= 10 V
= 4.5 V
= –10 V
= –4.5 V
Units
C/W
W
V
A
C

Related parts for FDS8333C

FDS8333C Summary of contents

Page 1

... Reel Size 7’’ August 2002 = DS(ON 130 4.5 V DS(ON 130 –10 V DS(ON 200 –4.5 V DS(ON Units 30 – 4.1 –3 – 0.9 –55 to +150 C 78 C/W 40 Tape width Quantity 12mm 2500 units FDS8333C Rev C (W) ...

Page 2

... Typ Max Units 30 V –30 25 mV/ C – –1 nA 100 nA 100 1 1 –1 –1.8 –3 –4.2 mV 130 81 145 103 105 130 200 167 220 147 10 A – 282 pF 185 2.3 –9 4.7 6.6 nC 4.1 5.7 0.9 nC 0.8 0.6 nC 0.4 FDS8333C Rev C (W) ...

Page 3

... A/µ –3 100 A/µ determined by the user's board design 125°C/W when mounted 0.02 in pad copper Min Typ Max Units 0.8 1.2 (Note 2) V 0.8 –1.2 (Note 2) 16.3 nS 14.5 26.7 nC 21.1 c) 135°C/W when mounted on a minimum pad. FDS8333C Rev C (W) ...

Page 4

... Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature. 3.5V 4.0V 4.5V 6.0V 10V DRAIN CURRENT ( 125 GATE TO SOURCE VOLTAGE (V) GS Gate-to-Source Voltage 125 -55 C 0.4 0.6 0 BODY DIODE FORWARD VOLTAGE (V) SD FDS8333C Rev C ( 1.2 ...

Page 5

... DS 10V 15V 300 200 100 C RSS Figure 8. Capacitance Characteristics 100 s 1ms 10ms 0.001 0.01 10 100 Figure 10. Single Pulse Maximum f = 1MHz ISS C OSS DRAIN TO SOURCE VOLTAGE ( SINGLE PULSE R = 135°C 25° 100 t , TIME (sec) 1 Power Dissipation. FDS8333C Rev C (W) 30 1000 ...

Page 6

... Figure 16. Body Diode Forward Voltage Variation with Source Current and Temperature. -4.0V -4.5V -5.0V -6.0V -10V DRAIN CURRENT ( -1. 125 GATE TO SOURCE VOLTAGE (V) GS Gate-to-Source Voltage 125 -55 C 0.4 0.6 0 BODY DIODE FORWARD VOLTAGE (V) SD FDS8333C Rev C ( 1.4 ...

Page 7

... Figure 20. Single Pulse Maximum 0.01 0 TIME (sec 1MHz ISS OSS DRAIN TO SOURCE VOLTAGE (V) DS SINGLE PULSE R = 135°C 25° 100 t , TIME (sec) 1 Power Dissipation. R ( 135 C/W JA P(pk ( Duty Cycle 100 1000 FDS8333C Rev C (W) 30 1000 ...

Page 8

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