FDY4000CZ Fairchild Semiconductor, FDY4000CZ Datasheet
FDY4000CZ
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FDY4000CZ Summary of contents
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... Thermal Resistance, Junction to Ambient TJA Package Marking and Ordering Information Device Marking Device E FDY4000CZ ©2009 Fairchild Semiconductor Corporation FDY4000CZ Rev. B2 General Description This Complementary N & P-Channel MOSFET has been designed using Fairchild Semiconductor’s advanced Power = 600mA D ® Trench process to optimize the r ...
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... Rise Time r t Turn-Off Delay Time d(off) t Fall Time f Q Total Gate Charge g Q Gate to Source Gate Charge gs Q Gate to Drain “Miller”Charge gd ©2009 Fairchild Semiconductor Corporation FDY4000CZ Rev 25°C unless otherwise noted J Test Conditions I = 250PA -250PA 250PA, referenced to 25° -250PA, referenced to 25° ...
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... Scale 1:1 on letter size paper 2: Pulse Test : Pulse Width < 300us, Duty Cycle < 2.0% 3: The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied. ©2009 Fairchild Semiconductor Corporation FDY4000CZ Rev 25°C unless otherwise noted J Test Conditions ...
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... Figure 3. Normalized on-Resistance vs. Temperature 1 -55 A 1.2 0.9 0.6 0.3 0 0 GATE TO SOURCE VOLTAGE (V) GS Figure 5. Transfer Characteristics ©2009 Fairchild Semiconductor Corporation FDY4000CZ Rev. B2 2.6 2.4 2.2 2 1.8 1.6 1.4 1.2 1 0.8 0. Figure 2. 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 1 ...
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... SINGLE PULSE 0.01 0.0001 0.001 Figure 11. Transient Thermal Response Curve Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. ©2009 Fairchild Semiconductor Corporation FDY4000CZ Rev. B2 100 0.6 ...
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... Figure 14. Normalized on-Resistance vs. Temperature -5V DS 0.8 0.6 0 125 C A 0.2 0 0 GATE TO SOURCE VOLTAGE (V) GS Figure 16. Transfer Characteristics ©2009 Fairchild Semiconductor Corporation FDY4000CZ Rev 2.2 1.8 -2.0V 1.4 -1.8V 1 0.6 0 1.5 2 Figure 13. 2 1.75 1.5 1.25 1 0.75 0.5 0. 100 ...
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... SINGLE PULSE 0.01 0.0001 0.001 Figure 22. Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. ©2009 Fairchild Semiconductor Corporation FDY4000CZ Rev. B2 150 125 100 -15V rss 0 2 2.5 0 Figure 19 ...
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... BOTTOM VIEW NOTES: A) THIS PACKAGE CONFORMS TO EIAJ SC89 PACKAGING STANDARD. B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DRAWING CONFORMS TO ASME Y14.5M-1994 D) DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND TIE BAR EXTRUSIONS. MAD06ArevA ©2009 Fairchild Semiconductor Corporation FDY4000CZ Rev 0.30 0.15 B 1.60 0 0.50 1.00 0.60 SEE DETAIL A 0 ...
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... Datasheet Identification Product Status Advance Information Formative / In Design Preliminary First Production No Identification Needed Full Production Obsolete Not In Production ©2009 Fairchild Semiconductor Corporation FDY4000CZ Rev. B2 FPS™ PowerTrench F-PFS™ PowerXS™ ® FRFET Programmable Active Droop™ SM ® Global Power Resource QFET Green FPS™ ...