MMBF5434 Fairchild Semiconductor, MMBF5434 Datasheet

IC SWITCH N-CHANNEL SUPERSOT-23

MMBF5434

Manufacturer Part Number
MMBF5434
Description
IC SWITCH N-CHANNEL SUPERSOT-23
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of MMBF5434

Current - Drain (idss) @ Vds (vgs=0)
30mA @ 15V
Fet Type
N-Channel
Voltage - Breakdown (v(br)gss)
25V
Voltage - Cutoff (vgs Off) @ Id
1V @ 3nA
Input Capacitance (ciss) @ Vds
30pF @ 10V (VGS)
Mounting Type
Surface Mount
Package / Case
TO-236-3, SC-59, SOT-23-3
Power - Max
350mW
Configuration
Single
Transistor Polarity
N-Channel
Power Dissipation
350 mW
Gate-source Breakdown Voltage
- 25 V
Gate-source Cutoff Voltage
- 4 V
Drain Current (idss At Vgs=0)
2 mA to 20 mA
Resistance Drain-source Rds (on)
10 Ohms
Maximum Operating Temperature
+ 150 C
Maximum Drain Gate Voltage
25 V
Minimum Operating Temperature
- 55 C
Mounting Style
Through Hole
Power Dissipation Pd
350mW
Operating Temperature Range
-55°C To +150°C
No. Of Pins
3
Current Rating
30mA
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence. This is a preliminary
notification. A Final PCN will be issued when qualification is complete and data is available.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Ursal, Randy
E-mail: Randy.Ursal@notes.fairchildsemi.com
Phone:
Implementation of change:
Expected 1st Device Shipment Date: 2008/01/14
Earliest Year/Work Week of Changed Product: D0803
Change Type Description: Mold Compound
Description of Change (From): SSOT-3 and SSOT-6 package assembly in FSC approved
manufacturing locations using non-Green mold compound as shown in table 1:
Description of Change (To): SSOT-3 and SSOT-6 package assembly at all FSC approved
manufacturing locations using Green mold compound as shown in table 2:
Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is
dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level
interconnect lead-free and RoHS compliance. The referenced material changes have been made
to provide a "Full Green" (Halogen Free Flame Retardant) package. For additional details on the
corporate wide green initiative please visit our Web site at:
http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same
assembly facilities producing the current non-green products. Package outline drawings of the
affected products remain un-changed. Green products will be fully compliant to all published
data sheet specifications and will be interchangeable with current non-green product. Quality
and reliability will remain at the highest standards already demonstrated with Fairchild's
existing products.
Qual/REL Plan Numbers : Q20070473
Qualification :
Qualification of Green Molding compound for SSOT-3 and SSOT-6.
Change From
Technical Contact:
Name: Uy, Lester
E-mail: Lester.Uy@fairchildsemi.com
Phone: 63-32-3415636
FORECAST CHANGE NOTIFICATION
Date Issued On : 2007/12/07
Date Created : 2007/11/29
PCN# : Q4074811
Pg. 1

Related parts for MMBF5434

MMBF5434 Summary of contents

Page 1

... This notification is for your information and concurrence. This is a preliminary notification. A Final PCN will be issued when qualification is complete and data is available. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. If you have any questions concerning this change, please contact: ...

Page 2

Change To Pg. 2 ...

Page 3

Qualification Stress Test and Sample Size Detail Device #1 FAN2558SX Package: TTG23 #Leads: 006 Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard ACLV X JESD22-A102 100%RH, 121C 96 SOPL1 JESD22-A108 NA%RH, 150C THBT X JESD22-A101 ...

Page 4

Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard ACLV X JESD22-A102 100%RH, 121C 96 PRCL MIL- STD-750-1036 TMCL1 X JESD22-A104 -65C, 150C Device #3 FDC637BNZ Package: TTK23 006 #Leads: Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment ...

Page 5

Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard ACLV X JESD22-A102 100%RH, 121C 96 H3TRB X JESD22-A101B85%RH, 85C, HAST2 X JESD22-A110 85%RH, 110C, HTGB JESD22-A108 150C, 25V HTRB JESD22-A108 150C, 24V PRCL MIL- STD-750-1036 TMCL1 ...

Page 6

... MIL- STD-750-1036 TMCL1 X JESD22-A104 -65C, 150C UHAST1 X JESD22-A118 100%RH, 121C 96 Product Id Description : This forecast notification covers Fairchild Semiconductor SSOT-3 & SSOT-6 packages. For complete listing of products covered in this PCN release, please refer to the Affected FSID listing. Affected FSIDs : 0332_B03005A FAN2559S13X FDC2512 ...

Page 7

... FDN352AP FDN357N FDN358P_NL FDN359BN FDN360P_NL FDN361BN FDN5618P FDN5630 FMB100 FMB2227A FMB3906 FMB5551 FMBA14 FMBM5401_SB74001 FMBS5401 FMBSA06 FMMT549 FSB619 FSB660A FSB749 MMBF5434 NDC631N NDC632P_F095 NDC651N_F073 NDC652P_F073 NDC7002N FDC642P_NL FDC645N FDC645N_NL FDC6506P_NL FDC653N_F095 FDC654P FDC654P_NBGT006 FDC654P_NL FDC655AN_NL FDC655BN_NBNN007 FDC6561AN FDC6561AN_SB5S012 FDC658P_F095 FDC658P_NB4E012 FDFC2P100 ...

Page 8

NDC7002N_SB9G007 NDS331N_D87Z NDS332P NDS335N NDS336P NDS351AN_NL NDS352AP NDS355AN_NB9L007A NDS356AP PB32_BPB003A SI3442DV_NL SI3454DV_F073 SI3456DV_NF073 SI3457DV_F073 NDC7003P NDS331N_ND87Z NDS332P_F080 NDS335N_D87Z NDS336P_NL NDS351AN_SBNL001 NDS352AP_NL NDS355AN_NL NDS356AP_NB8L005A SI3442DV_F073 SI3443DV SI3455DV_F073 SI3456DV_NL SI3457DV_F095 NDS331N NDS331N_NL NDS332P_NL NDS335N_NL NDS351AN NDS351N NDS355AN NDS355N NDS356AP_NL SI3442DV_NF073 SI3443DV_F095 SI3456DV_F073 ...

Related keywords