This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: SONG, HEEYUNG
E-mail: HEEYUNG.SONG@fairchildsemi.com
Phone: 82-32-680-1216
Implementation of change:
Expected 1st Device Shipment Date: 2007/05/21
Earliest Year/Work Week of Changed Product: 0721
Change Type Description: Bond Wire Diameter
Description of Change (From): 1. Die attach method: Two chip die attach 2. Wire size &
QTY:20mil *2ea per chip 3. Ass'y site for TO-220: SP, FSSZ Jedec, SHEDCL
Description of Change (To): 1. Die attach method: Dual chip die attach 2. Wire size &
QTY:15mil *1ea per chip 3. Ass'y site for TO-220: SP, FSSZ Jedec, SHEDCL, FSSZ none
Jedec, Enoch.
Reason for Change : Improvement of productivity for Schottky diodes mounting on
TO-220(Non jedec & Jedec type) . Different wire size and QTY of Schotky diodes have made
low productivity in current assembly line. Assembly sites for Schottky diodes are also limited
due to requiring of multi-chip mounting technology which is two chip mounting on
TO-220(Non jedec & Jedec type). So, We align ass'y BOM to other products in the same
in-house or subcontracts assembly line for better productivity without any electrical
performance shift.
Qual/REL Plan Numbers : Q20060442
Qualification :
The qualification plan is intended to meet our criteria for qualifying an alternative
assembly and test site the overall quality and reliability of our products
Results/Discussion
Test: (Autoclave)
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
Technical Contact:
Name: Kong, KwangYeom
E-mail: Tommy.Kong@fairchildsemi.co.kr
Phone: 82-32-680-1481
Date Issued On : 2007/04/27
Date Created : 2007/04/12
PCN# : Q1071005-A
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