BLF546 NXP Semiconductors, BLF546 Datasheet - Page 10

RF MOSFET Power BULK TNS-RFPR

BLF546

Manufacturer Part Number
BLF546
Description
RF MOSFET Power BULK TNS-RFPR
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BLF546

Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Product Type
MOSFET Power
Resistance Drain-source Rds (on)
0.6 Ohms
Transistor Polarity
N-Channel
Configuration
Dual Common Source
Drain-source Breakdown Voltage
65 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
9 A
Power Dissipation
145 W
Maximum Operating Temperature
+ 200 C
Package / Case
SOT-268-5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BLF546,112

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BLF546
Manufacturer:
TOSHIBA
Quantity:
101
Part Number:
BLF546
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
BLF546,112
Manufacturer:
HITTITE
Quantity:
1 400
Philips Semiconductors
2003 Sep 22
handbook, full pagewidth
UHF push-pull power MOS transistor
Dimensions in mm.
The circuit and components are situated on one side of the printed circuit board, the other side being fully
metallized, to serve as a ground plane. Earth connections are made by means of copper straps and hollow rivets
for a direct contact between upper and lower sheets.
L2
straps
L1
L3
C1
C2
L4
L5
C3
Fig.12 Component layout for 500 MHz test circuit.
C4
L6
L7
C5
C10 C11
C7 C8
L8
L9
R2
R6
C6
R3
R4
L10
L11
L12 L14
L13
C9 C18
200
10
L15
C14
C15
C19
L18
L19
L16
L17
L21
C12
L20
C17
R7
R8
C20
C21
V D
V D
L22
L23
C13
C16
C22
L24
L25
C23
C24
L27
L26
straps
Product specification
L28
MDA518
BLF546
85

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