AD9788-EBZ Analog Devices Inc, AD9788-EBZ Datasheet - Page 62

• Manufacturer Part Number: AD9788-EBZ
• Description: BOARD EVAL FOR AD9788
• Manufacturer: Analog Devices Inc
• Series: TxDAC®r

Specifications of AD9788-EBZ

• Design Resources: Powering the AD9788 Using ADP2105 for Increased Efficiency (CN0141)
• Number Of Dac's: 2
• Number Of Bits: 16
• Outputs And Type: 2, Differential
• Sampling Rate (per Second): 800M
• Data Interface: Serial
• Settling Time: 22ms
• Dac Type: Current
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9788
• Silicon Manufacturer: Analog Devices
• Application Sub Type: DAC
• Kit Application Type: Data Converter
• Silicon Core Number: AD9788
• Kit Contents: Board
• Development Tool Type: Hardware - Eval/Demo Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD9785/AD9787/AD9788
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9785BSVZ
AD9785BSVZRL
AD9787BSVZ
AD9787BSVZRL
AD9788BSVZ
AD9788BSVZRL
AD9785-EBZ
AD9787-EBZ
AD9788-EBZ
1
RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
NOTES:
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION
3. θ
OF THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE DEVICE,
WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
SEATING
JA
PLANE
: 27.4°C/W WITH THERMAL PAD UNSOLDERED, 19.1°C/W WITH THERMAL PAD SOLDERED TO PCB.
0.75
0.60
0.45
0.20
0.09
MAX
1.20
3.5°
7°
0°
Temperature Range
−40C to +85C
−40C to +85C
−40C to +85C
−40C to +85C
−40C to +85C
−40C to +85C
25
1
100
Figure 87. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
26
0.50 BSC
16.00 BSC SQ
PIN 1
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HDT
(PINS DOWN)
TOP VIEW
14.00 BSC SQ
Dimensions shown in millimeters
0.27
0.22
0.17
Rev. A | Page 62 of 64
(SV-100-1)
0.15
0.05
50
76
75
51
Package Description
100-Lead TQFP_EP
100-Lead TQFP_EP
100-Lead TQFP_EP
100-Lead TQFP_EP
100-Lead TQFP_EP
100-Lead TQFP_EP
Evaluation Board
Evaluation Board
Evaluation Board
1.05
1.00
0.95
COPLANARITY
0.08
75
51
50
76
BOTTOM VIEW
CONDUCTIVE
HEAT SINK
(PINS UP)
NOM
6.50
100
26
Package Option
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1
1
25