ADV7393-DBRDZ Analog Devices Inc, ADV7393-DBRDZ Datasheet - Page 18

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ADV7393-DBRDZ

Manufacturer Part Number
ADV7393-DBRDZ
Description
EVALUATION BOARD I.C.
Manufacturer
Analog Devices Inc
Series
Advantiv®r
Datasheet

Specifications of ADV7393-DBRDZ

Design Resources
Reconstruction Video Filter Using ADA4430-1 Amplifier After ADV7393 Video Encoder (CN0101)
Main Purpose
Video, Video Encoder
Utilized Ic / Part
ADV7393
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Secondary Attributes
-
Embedded
-
Primary Attributes
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ADV7390/ADV7391/ADV7392/ADV7393
ABSOLUTE MAXIMUM RATINGS
Table 13.
Parameter
V
V
PV
V
AGND to DGND
AGND to PGND
AGND to GND_IO
DGND to PGND
DGND to GND_IO
PGND to GND_IO
Digital Input Voltage to GND_IO
Analog Outputs to AGND
Max CLKIN Input Frequency
Storage Temperature Range (t
Junction Temperature (t
Lead Temperature (Soldering, 10 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
indefinite duration.
Analog output short circuit to any power supply or common can be of an
AA
DD
DD_IO
DD
to AGND
to DGND
to PGND
to GND_IO
1
J
)
S
)
Rating
−0.3 V to +3.9 V
−0.3 V to +2.3 V
−0.3 V to +2.3 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to V
−0.3 V to V
80 MHz
−60°C to +100°C
150°C
260°C
DD_IO
AA
+ 0.3 V
Rev. B | Page 18 of 108
THERMAL RESISTANCE
soldered in a circuit board for surface-mount packages.
Table 14. Thermal Resistance
Package Type
30-Ball WLCSP
32-Lead LFCSP
40-Lead LFCSP
1
2
The ADV739x is an RoHS-compliant, Pb-free product. The lead
finish is 100% pure Sn electroplate. The device is suitable for Pb-
free applications up to 255°C (±5°C) IR reflow (JEDEC STD-20).
The ADV739x is backward compatible with conventional SnPb
soldering processes. The electroplated Sn coating can be soldered
with SnPb solder pastes at conventional reflow temperatures of
220°C to 235°C.
ESD CAUTION
θ
Values are based on a JEDEC 4-layer test board.
With the exposed metal paddle on the underside of the LFCSP soldered to
the PCB ground.
JA
is specified for the worst-case conditions, that is, a device
1
θ
35
27
26
JA
2
θ
1
32
32
JC
Unit
°C/W
°C/W
°C/W

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