ADSP-BF514BBCZ-4F4 Analog Devices Inc, ADSP-BF514BBCZ-4F4 Datasheet - Page 64
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ADSP-BF514BBCZ-4F4
Manufacturer Part Number
ADSP-BF514BBCZ-4F4
Description
Low-Pwr BF Proc W/flash & Cnsmr Conctvty
Manufacturer
Analog Devices Inc
Series
Blackfin®r
Type
Fixed Pointr
Datasheets
1.ADSP-BF531SBSTZ400.pdf
(12 pages)
2.ADSP-BF512KSWZ-3.pdf
(68 pages)
3.ADSP-BF514BBCZ-4F4.pdf
(72 pages)
Specifications of ADSP-BF514BBCZ-4F4
Interface
I²C, PPI, RSI, SPI, SPORT, UART/USART
Clock Rate
400MHz
Non-volatile Memory
FLASH (4Mbit)
On-chip Ram
116kB
Voltage - I/o
1.8V, 2.5V, 3.3V
Voltage - Core
1.30V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
168-LFBGA
Architecture
Modified Harvard
Format
Fixed Point
Clock Freq (max)
400MHz
Device Input Clock Speed
400MHz
Ram Size
48KB
Program Memory Size
1024KB
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Package
168CSP-BGA
Numeric And Arithmetic Format
Fixed-Point
Maximum Speed
400 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ADSP-BF514BBCZ-4F4
Manufacturer:
AD
Quantity:
204
Company:
Part Number:
ADSP-BF514BBCZ-4F4
Manufacturer:
Analog Devices Inc
Quantity:
10 000
ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F
SURFACE-MOUNT DESIGN
Table 56
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 56. BGA Data for Use with Surface-Mount Design
Package
168-Ball CSP_BGA
is provided as an aid to PCB design. For industry
CORNER
A1 BALL
1.50
1.40
1.30
Package Ball Attach Type
Solder Mask Defined
Figure 73. 168-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
DETAIL A
TOP VIEW
12.10
12.00 SQ
11.90
COMPLIANT TO JEDEC STANDARDS MO-275-GGAB-1.
Rev. B | Page 64 of 68 | January 2011
Dimensions shown in millimeters
REF
0.36
(BC-168-1)
BSC SQ
SEATING
10.40
0.70
REF
PLANE
0.80
REF
BSC
0.80
Package Solder Mask
Opening
0.35 mm diameter
14 13
DETAIL A
12
BALL DIAMETER
11
BOTTOM VIEW
10
9
0.50
0.45
0.40
8
7
6
5
COPLANARITY
0.20
4
3
1.12
1.06
1.00
2
1
0.34 NOM
0.29 MIN
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Package Ball Pad Size
0.48 mm diameter
A1 BALL
CORNER