ADSP-BF514BBCZ-4F4 Analog Devices Inc, ADSP-BF514BBCZ-4F4 Datasheet - Page 63
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ADSP-BF514BBCZ-4F4
Manufacturer Part Number
ADSP-BF514BBCZ-4F4
Description
Low-Pwr BF Proc W/flash & Cnsmr Conctvty
Manufacturer
Analog Devices Inc
Series
Blackfin®r
Type
Fixed Pointr
Datasheets
1.ADSP-BF531SBSTZ400.pdf
(12 pages)
2.ADSP-BF512KSWZ-3.pdf
(68 pages)
3.ADSP-BF514BBCZ-4F4.pdf
(72 pages)
Specifications of ADSP-BF514BBCZ-4F4
Interface
I²C, PPI, RSI, SPI, SPORT, UART/USART
Clock Rate
400MHz
Non-volatile Memory
FLASH (4Mbit)
On-chip Ram
116kB
Voltage - I/o
1.8V, 2.5V, 3.3V
Voltage - Core
1.30V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
168-LFBGA
Architecture
Modified Harvard
Format
Fixed Point
Clock Freq (max)
400MHz
Device Input Clock Speed
400MHz
Ram Size
48KB
Program Memory Size
1024KB
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Package
168CSP-BGA
Numeric And Arithmetic Format
Fixed-Point
Maximum Speed
400 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ADSP-BF514BBCZ-4F4
Manufacturer:
AD
Quantity:
204
Company:
Part Number:
ADSP-BF514BBCZ-4F4
Manufacturer:
Analog Devices Inc
Quantity:
10 000
OUTLINE DIMENSIONS
Dimensions in
1.45
1.40
1.35
0.15
0.10
0.05
ROTATED 90 ° CCW
VIEW A
ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F
SEATING
PLANE
Figure 72
12°
0.08 MAX
COPLANARITY
7°
0°
1.00 REF
0.20
0.15
0.09
are shown in millimeters.
0.75
0.60
0.45
1.60
MAX
Figure 72. 176-Lead Low Profile Quad Flat Package [LQFP_EP]
VIEW A
44
176
1
45
Rev. B | Page 63 of 68 | January 2011
COMPLIANT TO JEDEC STANDARDS MS-026-BGA-HD
Dimensions shown in millimeters
PIN 1
26.20
26.00 SQ
25.80
LEAD PITCH
BSC
0.50
(PINS DOWN)
TOP VIEW
(SQ-176-2)
24.10
24.00 SQ
23.90
0.27
0.22
0.17
133
88
132
89
NOTE: THE EXPOSED PAD IS REQUIRED TO BE ELECTRICALLY AND
132
89
133
THERMALLY CONNECTED TO GND. IMPLEMENT THIS BY
SOLDERING THE EXPOSED PAD TO A GND PCB LAND THAT IS
THE SAME SIZE AS THE EXPOSED PAD. THE GND PCB LAND
SHOULD BE ROBUSTLY CONNECTED TO THE GND PLANE IN
THE PCB WITH AN ARRAY OF THERMAL VIAS FOR BEST
PERFORMANCE.
88
BOTTOM VIEW
EXPOSED
(PINS UP)
PAD
EXPOSED PAD IS CENTERED ON
THE PACKAGE.
45
176
1
44
5.80 REF
SQ