ADCLK854/PCBZ Analog Devices Inc, ADCLK854/PCBZ Datasheet - Page 6

• Manufacturer Part Number: ADCLK854/PCBZ
• Description: Evaluation Kit For 1.8v 6vvds/12 CMOS Cl
• Manufacturer: Analog Devices Inc

Specifications of ADCLK854/PCBZ

• Design Resources: Clock Distribution Circuit with Pin-Programmable Output Frequency, Output Logic Levels, and Fanout (CN0152)
• Main Purpose: Timing, Clock Buffer / Driver / Receiver / Translator
• Embedded: No
• Utilized Ic / Part: ADCLK854
• Primary Attributes: 2 Inputs, 12 Outputs
• Secondary Attributes: CMOS, LVDS Outputs
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADCLK854
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
Inputs
Outputs
Operating Temperature
Storage Temperature Range
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL PERFORMANCE
Table 6.
Parameter
Junction-to-Ambient Thermal Resistance
Junction-to-Board Thermal Resistance
Junction-to-Case Thermal Resistance
Junction-to-Top-of-Package Characterization Parameter
1
Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these calculations.
V
CLKx and CLKx
CMOS Inputs
Maximum Voltage
Voltage Reference Voltage (V
Junction
Still Air
Moving Air
Moving Air
Moving Air
Still Air
Ambient Range
S
0.0 m/sec Air Flow
1.0 m/sec Air Flow
2.5 m/sec Air Flow
1.0 m/sec Air Flow
Die-to-Heat Sink
0 m/sec Air Flow
to GND
REF
)
Rating
−0.3 V to +2 V
−0.3 V to +2 V
2 V
−0.3 V to +2 V
−0.3 to +2 V
−40°C to +85°C
150°C
−65°C to +150°C
Symbol
θ
θ
θ
θ
Ψ
JA
JMA
JB
JC
JT
Rev. 0 | Page 6 of 16
Description (Using a 2S2P Test Board)
Per JEDEC JESD51-2
Per JEDEC JESD51-6
Per JEDEC JESD51-8
Per MIL-STD 883, Method 1012.1
Per JEDEC JESD51-2
DETERMINING JUNCTION TEMPERATURE
To determine the junction temperature on the application
printed circuit board (PCB), use the following equation:
where:
T
T
top center of the package.
Ψ
P
Values of θ
design considerations. θ
mation of T
where T
Values of θ
and PCB design considerations.
ESD CAUTION
D
J
CASE
JT
is the junction temperature (°C).
is the power dissipation.
is from Table 6.
T
T
is the case temperature (°C) measured by the user at the
J
J
= T
= T
A
is the ambient temperature (°C).
CASE
A
JA
JB
J
+ (
by the equation
are provided for package comparison and PCB
are provided in Table 6 for package comparison
+ ( Ψ
θ
JA
× P
JT
× P
D
)
JA
D
)
can be used for a first-order approxi-
Value
42
37
33
26
2
0.5
1
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W