HSDL-3000#007 Lite-On Electronics, HSDL-3000#007 Datasheet - Page 11

• Manufacturer Part Number: HSDL-3000#007
• Description: Infrared Transceivers IR Transceiver 115.2Kb/s
• Manufacturer: Lite-On Electronics

Specifications of HSDL-3000#007

• Wavelength: 875 nm
• Continual Data Transmission: 115.2 Kbit/s
• Transmission Distance: 1.5 m
• Radiant Intensity: 75 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 7.5 us, 1.6 us
• Maximum Rise Time: 100 ns, 600 ns
• Maximum Fall Time: 100 ns, 600 ns
• Led Supply Voltage: 0 V to 7 V
• Operating Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 20 C
• Dimensions: 9.1 mm x 3.65 mm x 2.7 mm
• Data Rate: 115.2kbs (SIR)
• Idle Current, Typ @ 25° C: 0.02µA
• Link Range, Low Power: 1.5m
• Operating Temperature: -20°C ~ 70°C
• Orientation: Side View
• Shutdown: *
• Size: 9.1mm x 3.65mm x 2.7mm
• Standards: IrPHY 1.3
• Supply Voltage: 2.7 V ~ 5.5 V
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

1.2 Adjacent Land Keep-out and Solder Mask Areas
• Adjacent land keep-out is the maximum space
• “h” is the minimum solder resist strip width required
• It is recommended that 2 fiducial cross be placed at
Note: Wet/Liquid Photo-Imageable solder resist/mask is
recommended.
2.0 Recommended Solder Paste/Cream Volume for
Castellation Joints
The recommended printed solder paste volume required
per castellation pad is 0.30 cubic mm (based on either
no-clean or aqueous solder cream types with typically
60 to 65% solid content by volume).
Figure 3. HSDL-3000#007/#017 PCBA – Adjacent land keep-out and solder mask.
11
Dim.
h
j
k
l
occupied by the unit relative to the land pattern.
There should be no other SMD components within
this area.
to avoid solder bridging adjacent pads.
mid-length of the pads for unit alignment.
LAND
mm
min. 0.40
10.1
3.85
3.2
Rx LENS
HSDL-3000 fig 3.0 PCBA Land Keep-Out
h
Inches
min. 0.016
0.40
0.15
0.126
j
Y
Tx LENS
X
SOLDER
MASK
k
l
2.1 Recommended Metal Solder Stencil Aperture
It is recommended that only 0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick stencil be used for solder
paste printing. This is to ensure adequate printed solder
paste volume and no shorting. The following combina-
tion of metal stencil aperture and metal stencil thick-
ness should be used:
w, the width of aperture, is fixed at 0.85 mm (0.034 inches).
Aperture opening for shield pad is 3.05 mm x 1.1 mm as per land dimen-
sion.
Figure 4. Solder paste stencil aperture.
t, Nominal Stencil Thickness
mm
0.152
0.127
APERTURES AS PER
LAND DIMENSIONS
SOLDER PASTE
l
inches
0.006
0.005
HSDL-300 Solder Stencil
mm
2.3 ± 0.05
2.75 ± 0.05
l, Length of Aperture
w
inches
0.091 ± 0.002
0.108 ± 0.002
t (STENCIL THICKNESS)
See Fig. 4.