DSPIC30F6010-20E/PF Microchip Technology, DSPIC30F6010-20E/PF Datasheet - Page 219

• Manufacturer Part Number: DSPIC30F6010-20E/PF
• Description: IC,DSP,16-BIT,CMOS,TQFP,80PIN,PLASTIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6010-20E/PF

• Rohs Compliant: YES
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 144KB (48K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 80-TQFP, 80-VQFP
• Package: 80TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 16-chx10-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300019 - BOARD DEMO DSPICDEM 80L STARTERAC164314 - MODULE SKT FOR PM3 80PFDM300020 - BOARD DEV DSPICDEM MC1 MOTORCTRLAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: DSPIC30F601020EPF

40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
© 2007 Microchip Technology Inc.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
Dimension Limits
Confidential
Units
A2
A1
E1
b1
eB
N
A
E
D
e
L
c
b
e
A2
1.980
.125
.015
.590
.485
.115
.008
.030
.014
MIN
dsPIC30F4011/4012
E1
–
–
L
.100 BSC
INCHES
NOM
40
–
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-016B
eB
E
2.095
MAX
.250
.625
.200
.070
.023
.700
.195
.580
.015
–
DS70135E-page 217
c