DSPIC30F6010-20E/PF Microchip Technology, DSPIC30F6010-20E/PF Datasheet - Page 174
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
DSPIC30F6010-20E/PF
Manufacturer Part Number
DSPIC30F6010-20E/PF
Description
IC,DSP,16-BIT,CMOS,TQFP,80PIN,PLASTIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F6010A-30IPF.pdf
(22 pages)
2.DSPIC30F6010-20IPF.pdf
(222 pages)
3.DSPIC30F6010-20IPF.pdf
(30 pages)
4.DSPIC30F4011-20IML.pdf
(236 pages)
Specifications of DSPIC30F6010-20E/PF
Rohs Compliant
YES
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
80-TQFP, 80-VQFP
Package
80TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx10-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300019 - BOARD DEMO DSPICDEM 80L STARTERAC164314 - MODULE SKT FOR PM3 80PFDM300020 - BOARD DEV DSPICDEM MC1 MOTORCTRLAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DSPIC30F601020EPF
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6010-20E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC30F6010A-30IPF PDF datasheet
- DSPIC30F6010-20IPF PDF datasheet #2
- DSPIC30F6010-20IPF PDF datasheet #3
- DSPIC30F4011-20IML PDF datasheet #4
- Current page: 174 of 236
- Download datasheet (4Mb)
dsPIC30F4011/4012
TABLE 24-2:
TABLE 24-3:
TABLE 24-4:
DS70135E-page 172
dsPIC30F401X-30I
dsPIC30F401X-20E
Power Dissipation:
Internal Chip Power Dissipation:
P
I/O Pin power dissipation:
P
Maximum Allowed Power Dissipation
Package Thermal Resistance, 28-pin SPDIP (SP)
Package Thermal Resistance, 28-pin SOIC (SO)
Package Thermal Resistance, 40-pin PDIP (P)
Package Thermal Resistance, 44-pin TQFP, 10x10x1 mm (PT)
Package Thermal Resistance, 44-pin QFN (ML)
Note 1:
DC CHARACTERISTICS
Param
Operating Voltage
DC10
DC11
DC12
DC16
DC17
Note 1:
INT
I
No.
/
O
= ∑ ({V
= V
2:
3:
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
DD X
V
V
V
V
S
Symbol
DD
DD
DR
POR
VDD
Junction to ambient thermal resistance, Theta-ja (θ
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which V
DD
(I
DD
– V
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
THERMAL OPERATING CONDITIONS
– ∑ I
OH
Supply Voltage
Supply Voltage
RAM Data Retention
Voltage
V
to ensure internal
Power-on Reset signal
V
to ensure internal
Power-on Reset signal
(2)
DD
DD
}
X
OH
Start Voltage
Rise Rate
Characteristic
I
OH
)
Characteristic
(3)
) + ∑ (V
Rating
OL X
DD
can be lowered without losing RAM data.
I
OL
)
Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)
Operating temperature
0.05
Min
2.5
3.0
—
—
Confidential
Typ
V
1.5
—
—
—
SS
(1)
JA
) numbers are achieved by package simulations.
Max
5.5
5.5
—
—
—
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
P
T
T
T
T
-40°C ≤ T
-40°C ≤ T
JA
JA
JA
JA
JA
A
A
D
J
J
Units
V/ms 0-5V in 0.1 sec,
V
V
V
V
Min
Typ
-40
-40
-40
-40
A
A
Industrial temperature
Extended temperature
0-3V in 60 ms
41
45
37
40
28
≤ +85°C for Industrial
≤ +125°C for Extended
(T
© 2007 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
+ P
A
Conditions
)/θ
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
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