GS816032BGT-200 GSI TECHNOLOGY, GS816032BGT-200 Datasheet - Page 17

18M SYNCH BURST SRAM 512KX32, SMD

GS816032BGT-200

Manufacturer Part Number
GS816032BGT-200
Description
18M SYNCH BURST SRAM 512KX32, SMD
Manufacturer
GSI TECHNOLOGY
Datasheet

Specifications of GS816032BGT-200

Memory Size
18Mbit
Clock Frequency
200MHz
Access Time
6.5ns
Supply Voltage Range
2.3V To 2.7V, 3V To 3.6V
Memory Case Style
TQFP
No. Of Pins
100
Operating Temperature Range
0°C To +70°C
Memory Configuration
512K X 32
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
AC Electrical Characteristics
Notes:
1.
2.
Rev: 1.03 9/2005
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Flow Through
These parameters are sampled and are not 100% tested.
ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold times
as specified above.
Pipeline
Clock to Output in Low-Z
Clock to Output in Low-Z
Clock to Output Invalid
Clock to Output Invalid
Clock to Output Valid
Clock to Output Valid
G to output in High-Z
G to output in Low-Z
Clock to Output in
Clock Cycle Time
Clock Cycle Time
Clock HIGH Time
Clock LOW Time
G to Output Valid
ZZ setup time
Parameter
ZZ hold time
ZZ recovery
Setup time
Setup time
Hold time
Hold time
High-Z
Symbol
tOHZ
tOLZ
tZZS
tZZH
tKQX
tKQX
tHZ
tZZR
tLZ
tLZ
tKC
tKQ
tKC
tKQ
tKH
tOE
tKL
tS
tH
tS
tH
1
1
1
1
2
2
1
17/24
Min
4.0
1.5
1.5
1.2
0.2
5.5
2.0
2.0
1.5
0.5
1.3
1.5
1.5
20
0
5
1
-250
Max
2.5
5.5
2.5
2.5
2.5
Min
5.0
1.5
1.5
1.4
0.4
6.5
2.0
2.0
1.5
0.5
1.3
1.5
1.5
20
0
5
1
-200
GS816018/32/36BT-250/200/150
Max
3.0
6.5
3.0
3.0
3.0
Min
6.7
1.5
1.5
1.5
0.5
7.5
2.0
2.0
1.5
0.5
1.5
1.7
1.5
20
0
5
1
-150
© 2004, GSI Technology
Max
3.8
7.5
3.0
3.8
3.8
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns

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