3059Y-1-500LF Bourns Inc., 3059Y-1-500LF Datasheet - Page 154

• Manufacturer Part Number: 3059Y-1-500LF
• Description: TRIMPOT 50 OHM 1.25"REC CER MT
• Manufacturer: Bourns Inc.
• Series: 3059 - Sealedr

Specifications of 3059Y-1-500LF

• Temperature Coefficient: ±100ppm/°C
• Resistance (ohms): 50
• Termination Style: PC Pin
• Power (watts): 1W
• Tolerance: ±10%
• Number Of Turns: 22
• Adjustment Type: Side Adjustment
• Resistive Material: Cermet
• Mounting Type: Chassis Mount
• Package / Case: Rectangular - 1.250" L x 0.190" W x 0.315" H (31.75mm x 4.83mm x 8.00mm)
• Track Resistance: 50ohm
• No. Of Turns: 22
• Resistance Tolerance: ± 10%
• Power Rating: 1W
• Potentiometer Mounting: Through Hole
• Resistance: 50 Ohms
• Operating Temperature Range: - 55 C to + 150 C
• Element Type: Cermet
• Dimensions: 6.10 mm W x 31.75 mm L
• Product: Trimmers
• Taper: Linear
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Applications/Processing Guide – Standard and Lead Free
Processability
“Processability” refers to the ability of the unit to withstand the
production-line processes associated with the finishing steps on
the PC boards. Typically, both SMT and through-hole products
are subjected to similar PC board processing operations after
preparation for assembly. These operations can generally be
summarized as follows:
Soldering (SMT)
Four types of equipment are usually associated with SMT
soldering:
Soldering (Through-hole)
Two types of equipment are usually associated with through-hole
soldering:
152
IR System — Uses a multi-zone infrared furnace with IR
elements heated to a temperature substantially above chamber
or product temperature. Energy is supplied to the product
primarily by IR radiation to reflow solder.
Forced Hot Air Convection System — Uses a multizone forced
air convection system with heat source panels using IR or
other type heating elements. Approximately 85 % of the
heating is provided by free convection to reflow solder on
exposed PC boards.
Dual Wave System — Utilizes two parallel solder waves. The
first is a turbulent wave followed by a laminar wave. The
turbulent wave is for small, constricted areas, while the
laminar wave removes solder projections.
Vapor Phase System — Provides a single-zone condensation
heat source achieved with liquid fluorinated hydrocarbons
that have been brought to the boiling point to create a
saturated vapor zone. Heat is then released by the fluid’s heat
of vaporization as the vapor condenses on the product.
Single Wave System — Provides an inclined portion of the
solder wave for the PC board to pass over. The PC board is
positioned to bring many potential solder joints in contact
with the wave simultaneously for a short time for soldering.
Drag System — Provides for PC boards to be dragged across
the surface of the solder pot. Soldered connections are made
during this operation.
WASH
FLUX
PRE-HEAT
RINSE
SOLDER
DRY
PC Board Washing
Two types of equipment are usually associated with both SMT
and through-hole products.
Soldering and Wash Processes
Figure 1 shows typical profiles any component may see during a
soldering and board washing operation. For details of material
and process variables recommendations, see “Soldering and
Cleaning Processes”, page 152.
°C/Min.
°C
Critical profile parameters
1
2
3
4
Pressure System — Accomplishes cleaning by directing sprays
of water under high pressure from multiple nozzles.
Flooding System — Utilizes a combination of flooding (at
normal water pressure) and surfactant action for cleaning.
Temperature Shock (°C)
Maximum Temperature (°C)
Temperature Exposure (Minimum)
Temperature Gradient (°C)
Typical temperature profile for board washing and soldering.
1
3
2
4
(Indicator of Level of Stability)
5
Rate of Change of Profile
Minutes
Minutes
Figure 1
5
6
7
Temperature Shock Decrease in Water (°C)
Temperature Shock Decrease in Water
& Air Pressure (°C)
Unstable Temperature
6
7
Unstable Temp.
(# of Cycles)
Top
Mounted
Thermocouple
Bottom
Mounted
Thermocouple