FAN7393MX Fairchild Semiconductor, FAN7393MX Datasheet - Page 4

• Manufacturer Part Number: FAN7393MX
• Description: IC GATE DVR HALF BRIDGE 14-SOIC
• Manufacturer: Fairchild Semiconductor
• Type: Half-Bridge Gate Drive ICr

Specifications of FAN7393MX

• Configuration: Half Bridge
• Input Type: Non-Inverting
• Delay Time: 550ns
• Current - Peak: 2.5A
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 600V
• Voltage - Supply: 10 V ~ 20 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Product: Half-Bridge Drivers
• Rise Time: 40 ns
• Fall Time: 20 ns
• Propagation Delay Time: 550 ns
• Supply Voltage (max): 620 V
• Supply Voltage (min): 6 V
• Supply Current: 1.3 mA
• Maximum Power Dissipation: 1 W
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Bridge Type: Half Bridge
• Maximum Turn-off Delay Time: 400 ns
• Maximum Turn-on Delay Time: 850 ns
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Output Current: 2.5 A
• Output Voltage: 620 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

© 2009 Fairchild Semiconductor Corporation
FAN7393 • Rev. 1.0.0
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. T
Notes:
1.
2.
3.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Note:
4.
Symbol
Symbol
Refer to the following standards:
Do not exceed maximum P
Shutdown (SD) input is internally clamped with 5.2V.
Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material).
dV
JESD51-2: Integral circuits thermal test method environmental conditions - natural convection, and
JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages.
T
V
V
V
V
V
V
V
V
V
V
V
V
θ
DT
DT
V
V
V
V
P
T
T
STG
HO
HO
DD
LO
SD
SS
DD
SD
S
JA
LO
SS
IN
IN
A
D
B
S
B
S
J
/dt
High-Side Floating Supply Voltage
High-Side Floating Supply Offset Voltage
High-Side Output Voltage
Low-Side and Logic Fixed Supply Voltage
Low-Side Output Voltage
Logic Input Voltage (IN)
Logic Input Voltage (SD)
Programmable Dead-Time Pin Voltage
Logic Ground
Operating Ambient Temperature
High-Side Floating Supply Voltage
High-Side Floating Offset Voltage
High-Side Floating Output Voltage
Low-Side Output Voltage
Low-Side and Logic Fixed Supply Voltage
Logic Input Voltage (IN)
Logic Input Voltage (SD)
Programmable Dead-time Pin Voltage
Logic Ground
Allowable Offset Voltage Slew Rate
Power Dissipation
Thermal Resistance
Junction Temperature
Storage Temperature
D
under any circumstances.
Characteristics
(1, 2, 3)
Parameter
(4)
A
=25°C unless otherwise specified.
4
V
V
6-V
V
COM
V
Min.
Min.
V
V
V
DD
S
-40
-0.3
-0.3
-0.3
-0.3
V
-0.3
S
V
10
-55
B
-5
+10
SS
SS
SS
-0.3
SS
-25
S
DD
-25
V
V
V
V
V
V
V
Max.
625.0
Max.
DD
DD
DD
DD
+150
+150
+125
25.0
± 50
B
B
V
V
V
110
S
600
5.5
V
20
+5
+0.3
+0.3
1
5
+20
DD
DD
DD
+0.3
+0.3
+0.3
+0.3
B
www.fairchildsemi.com
°C/W
Unit
Unit
V/ns
°C
°C
°C
W
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V