W25Q64CVSSIG Winbond Electronics, W25Q64CVSSIG Datasheet - Page 8

• Manufacturer Part Number: W25Q64CVSSIG
• Description: IC SPI FLASH 64MBIT 8-SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q64CVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 64M (8M x 8)
• Speed: 80MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.083", 2.10mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: Q5822008

7. PIN CONFIGURATION SOIC 300-MIL
8. PIN DESCRIPTION SOIC 300-MIL
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
PAD NO.
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
PAD NAME
/HOLD (IO3)
/WP (IO2)
DO (IO1)
Figure 1d. W25Q64CV Pin Assignments, 16-pin SOIC 300-mil (Package Code SF)
DI (IO0)
GND
VCC
CLK
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
/CS
I/O
I/O
I/O
I/O
I/O
I
I
Hold Input (Data Input Output 3)*
Power Supply
No Connect
No Connect
No Connect
No Connect
Chip Select Input
Data Output (Data Input Output 1)*
Write Protect Input (Data Input Output 2)*
Ground
No Connect
No Connect
No Connect
No Connect
Data Input (Data Input Output 0)*
Serial Clock Input
- 8 -
FUNCTION
2
1
1
2
W25Q64CV