W25Q64CVSSIG Winbond Electronics, W25Q64CVSSIG Datasheet - Page 47

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W25Q64CVSSIG

Manufacturer Part Number
W25Q64CVSSIG
Description
IC SPI FLASH 64MBIT 8-SOIC
Manufacturer
Winbond Electronics
Datasheet

Specifications of W25Q64CVSSIG

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
64M (8M x 8)
Speed
80MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (0.083", 2.10mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q5822008

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Part Number
Manufacturer
Quantity
Price
Part Number:
W25Q64CVSSIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
Company:
Part Number:
W25Q64CVSSIG
Quantity:
15
W25Q64CV
11.2.28 Erase / Program Resume (7Ah)
The Erase/Program Resume instruction “7Ah” must be written to resume the Sector or Block Erase
operation or the Page Program operation after an Erase/Program Suspend. The Resume instruction
“7Ah” will be accepted by the device only if the SUS bit in the Status Register equals to 1 and the BUSY
bit equals to 0. After issued the SUS bit will be cleared from 1 to 0 immediately, the BUSY bit will be set
from 0 to 1 within 200ns and the Sector or Block will complete the erase operation or the page will
complete the program operation. If the SUS bit equals to 0 or the BUSY bit equals to 1, the Resume
instruction “7Ah” will be ignored by the device. The Erase/Program Resume instruction sequence is
shown in figure 26.
Resume instruction is ignored if the previous Erase/Program Suspend operation was interrupted by
unexpected power off. It is also required that a subsequent Erase/Program Suspend instruction not to be
issued within a minimum of time of “t
” following a previous Resume
instruction.
SUS
Figure 26. Erase/Program Resume Instruction Sequence
Publication Release Date: January 4, 2010
- 47 -
Preliminary - Revision B

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