W25Q64CVSSIG Winbond Electronics, W25Q64CVSSIG Datasheet - Page 51
W25Q64CVSSIG
Manufacturer Part Number
W25Q64CVSSIG
Description
IC SPI FLASH 64MBIT 8-SOIC
Manufacturer
Winbond Electronics
Datasheet
1.W25Q64CVSSIG.pdf
(74 pages)
Specifications of W25Q64CVSSIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
64M (8M x 8)
Speed
80MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (0.083", 2.10mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q5822008
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
W25Q64CVSSIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
W25Q64CV
11.2.31 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in figure 30. The Device ID values for the W25Q64CV is listed in Manufacturer and Device Identification
table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by
the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one to
the other. The instruction is completed by driving /CS high.
31 32
33 34 35 36 37 38 39
40 41 42 43 44
45 46
Figure 30. Read Manufacturer / Device ID Diagram
Publication Release Date: January 4, 2010
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Preliminary - Revision B