W25Q64CVSSIG Winbond Electronics, W25Q64CVSSIG Datasheet - Page 2

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W25Q64CVSSIG

Manufacturer Part Number
W25Q64CVSSIG
Description
IC SPI FLASH 64MBIT 8-SOIC
Manufacturer
Winbond Electronics
Datasheet

Specifications of W25Q64CVSSIG

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
64M (8M x 8)
Speed
80MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (0.083", 2.10mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q5822008

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
W25Q64CVSSIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
Company:
Part Number:
W25Q64CVSSIG
Quantity:
15
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11.
GENERAL DESCRIPTION ............................................................................................................... 5
FEATURES....................................................................................................................................... 5
PIN CONFIGURATION SOIC 208-MIL ............................................................................................ 6
PAD CONFIGURATION WSON 6X5-MM / 8X6-MM ....................................................................... 6
PAD CONFIGURATION PDIP 300-MIL ........................................................................................... 7
PIN DESCRIPTION SOIC 208-MIL, WSON 6X5/8X6-MM AND PDIP 300-MIL .............................. 7
PIN CONFIGURATION SOIC 300-MIL ............................................................................................ 8
PIN DESCRIPTION SOIC 300-MIL .................................................................................................. 8
8.1
8.2
8.3
8.4
8.5
8.6
BLOCK DIAGRAM.......................................................................................................................... 10
FUNCTIONAL DESCRIPTION ....................................................................................................... 11
10.1
10.2
CONTROL AND STATUS REGISTERS ........................................................................................ 13
11.1
Package Types..................................................................................................................... 9
Chip Select (/CS).................................................................................................................. 9
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9
Write Protect (/WP)............................................................................................................... 9
HOLD (/HOLD) ..................................................................................................................... 9
Serial Clock (CLK) ................................................................................................................ 9
SPI OPERATIONS ............................................................................................................. 11
10.1.1
10.1.2
10.1.3
10.1.4
WRITE PROTECTION ....................................................................................................... 12
10.2.1
STATUS REGISTER .......................................................................................................... 13
11.1.1
11.1.2
11.1.3
11.1.4
11.1.5
11.1.6
11.1.7
11.1.8
11.1.9
11.1.10
11.1.11
Standard SPI Instructions...................................................................................................11
Dual SPI Instructions ..........................................................................................................11
Quad SPI Instructions.........................................................................................................11
Hold Function .....................................................................................................................11
Write Protect Features........................................................................................................12
BUSY..................................................................................................................................13
Write Enable Latch (WEL) ..................................................................................................13
Block Protect Bits (BP2, BP1, BP0)....................................................................................13
Top/Bottom Block Protect (TB)...........................................................................................13
Sector/Block Protect (SEC) ................................................................................................13
Complement Protect (CMP) ...............................................................................................14
Status Register Protect (SRP1, SRP0)...............................................................................14
Erase/Program Suspend Status (SUS) ..............................................................................14
Security Register Lock Bits (LB3, LB2, LB1, LB0) ..............................................................14
Quad Enable (QE) ............................................................................................................15
Status Register Memory Protection (CMP = 0).................................................................16
Table of Contents
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W25Q64CV

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