EVAL-PAN1321 Panasonic, EVAL-PAN1321 Datasheet - Page 38

Bluetooth / 802.15.1 Modules & Development Tools

EVAL-PAN1321

Manufacturer Part Number
EVAL-PAN1321
Description
Bluetooth / 802.15.1 Modules & Development Tools
Manufacturer
Panasonic
Datasheets

Specifications of EVAL-PAN1321

Wireless Frequency
2.4 GHz
Interface Type
I2C, JTAG, UART
Data Rate
3 Mbps
Modulation
DQPSK
Operating Voltage
2.7 V to 3.6 V
Operating Temperature Range
- 40 C to + 85 C
Output Power
2.5 dBm
Technology/ Type
PAN1321 Evaluation Kit
Processor Series
PAN1321
For Use With/related Products
ENW-89811K4CF
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
9.5
Generally all standard reflow soldering processes (vapour phase, convection, infrared) and typical temperature
profiles used for surface mount devices are suitable for the PAN1321 module. Wave soldering is not possible.
Figure 14
solder.
Figure 14
Figure 15
Hardware Description
User’s Manual
Recommended temp. profile
for reflow soldering (J-STD-020C)
260°C
255°C
217°C
200°C
150°C
25°C
Temp.[°C]
and
Soldering Profile
Eutectic Lead-Solder Profile
Eutectic Leadfree-Solder Profile
Recommended temp. profile
for reflow soldering
Temp
Figure 15
.[°C]
150 ±10°C
shows example of a suitable solder reflow profile. One for leaded and one for leadfree
60 ~ 120
8 minutes max
235°C max.
220 ±5°C
sec @ 3’C/sec max
200°C
38
90 ±30s
60 ~ 150
30 sec
max
30 +20/-10s
sec
Lead _S older _P rof ile .v s d
10 ±1s
LeadF ree _S older _P rof ile . v s d
Revision 3.1, 2011-01-18
Time [s]
Assembly Guidelines
6’C/sec
ENW89811K4CF
max
PAN1321-SPP
Time [s]

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