LFXP2-8E-7FT256C Lattice, LFXP2-8E-7FT256C Datasheet - Page 2

FPGA - Field Programmable Gate Array 8K LUTs 201I/O Inst- on DSP 1.2V -7 Spd

LFXP2-8E-7FT256C

Manufacturer Part Number
LFXP2-8E-7FT256C
Description
FPGA - Field Programmable Gate Array 8K LUTs 201I/O Inst- on DSP 1.2V -7 Spd
Manufacturer
Lattice
Datasheet

Specifications of LFXP2-8E-7FT256C

Number Of Macrocells
8000
Number Of Programmable I/os
201
Data Ram Size
226304
Supply Voltage (max)
1.26 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Supply Voltage (min)
1.14 V
Package / Case
FTBGA-256
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LFXP2-8E-7FT256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
www.latticesemi.com
© 2011 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
April 2011
Section I. LatticeXP2 Family Data Sheet
Introduction
Architecture
Features ............................................................................................................................................................. 1-1
Introduction ........................................................................................................................................................ 1-2
Architecture Overview ........................................................................................................................................ 2-1
PFU Blocks ........................................................................................................................................................ 2-2
Routing............................................................................................................................................................... 2-6
sysCLOCK Phase Locked Loops (PLL) ............................................................................................................. 2-6
Clock Dividers .................................................................................................................................................... 2-7
Clock Distribution Network ................................................................................................................................. 2-8
sysMEM Memory ............................................................................................................................................. 2-16
sysDSP™ Block ............................................................................................................................................... 2-18
Optimized DSP Functions ................................................................................................................................ 2-25
Programmable I/O Cells (PIC) ......................................................................................................................... 2-26
PIO ................................................................................................................................................................... 2-27
Slice .......................................................................................................................................................... 2-3
Modes of Operation................................................................................................................................... 2-5
Primary Clock Sources.............................................................................................................................. 2-8
Secondary Clock/Control Sources .......................................................................................................... 2-10
Edge Clock Sources................................................................................................................................ 2-11
Primary Clock Routing ............................................................................................................................ 2-12
Dynamic Clock Select (DCS) .................................................................................................................. 2-12
Secondary Clock/Control Routing ........................................................................................................... 2-12
Slice Clock Selection............................................................................................................................... 2-14
Edge Clock Routing ................................................................................................................................ 2-15
sysMEM Memory Block........................................................................................................................... 2-16
Bus Size Matching .................................................................................................................................. 2-16
FlashBAK EBR Content Storage............................................................................................................. 2-16
Memory Cascading ................................................................................................................................. 2-17
Single, Dual and Pseudo-Dual Port Modes............................................................................................. 2-17
Memory Core Reset ................................................................................................................................ 2-17
EBR Asynchronous Reset....................................................................................................................... 2-18
sysDSP Block Approach Compare to General DSP ............................................................................... 2-18
sysDSP Block Capabilities ...................................................................................................................... 2-19
MULT sysDSP Element .......................................................................................................................... 2-20
MAC sysDSP Element ............................................................................................................................ 2-21
MULTADDSUB sysDSP Element ........................................................................................................... 2-22
MULTADDSUBSUM sysDSP Element ................................................................................................... 2-23
Clock, Clock Enable and Reset Resources ............................................................................................ 2-23
Signed and Unsigned with Different Widths............................................................................................ 2-24
OVERFLOW Flag from MAC .................................................................................................................. 2-24
IPexpress™............................................................................................................................................. 2-25
Resources Available in the LatticeXP2 Family........................................................................................ 2-25
LatticeXP2 DSP Performance................................................................................................................. 2-25
Input Register Block ................................................................................................................................ 2-27
Output Register Block ............................................................................................................................. 2-28
Tristate Register Block ............................................................................................................................ 2-30
LatticeXP2 Family Handbook
1
Table of Contents

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