LFXP6C-4TN144I Lattice, LFXP6C-4TN144I Datasheet - Page 387
LFXP6C-4TN144I
Manufacturer Part Number
LFXP6C-4TN144I
Description
FPGA - Field Programmable Gate Array 5.8K LUTs 100 IO 1.8 /2.5/3.3V -4 Spd I
Manufacturer
Lattice
Specifications of LFXP6C-4TN144I
Number Of Programmable I/os
100
Data Ram Size
73728
Supply Voltage (max)
3.465 V
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (min)
1.71 V
Package / Case
TQFP-144
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP6C-4TN144I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Lattice Semiconductor
256-ball caBGA BGA Breakout Examples
This BGA breakout and routing example places a MachXO PLD in a 14x14 mm, 0.8 mm pitch, 256-ball caBGA
package (LCMXO2280-B256/BN256) into two fabrication scenarios. One for a 6-layer stack up with maximum I/O
utilization and a 4-layer with about 10% fewer I/Os. The 6-layer design (Example #1), demonstrates the best use of
mechanically drill blind vias to place caps near power pins to minimize layers.
Figure 14-10. CAM Artwork Screen Shots, Example #1, 256-Ball caBGA
Layer 1 Primary
Layer 5 Signal
Layer 3 GND
14-12
Layer 6 Secondary
PCB Layout Recommendations
Layer 2 Signal
Layer 4 Power
for BGA Packages
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