A2F200M3F-1FGG256 Actel, A2F200M3F-1FGG256 Datasheet - Page 11

• Manufacturer Part Number: A2F200M3F-1FGG256
• Description: FPGA - Field Programmable Gate Array 200K System Gates SmartFusion
• Manufacturer: Actel

Specifications of A2F200M3F-1FGG256

• Processor Series: A2F200
• Core: ARM Cortex M3
• Number Of Logic Blocks: 8
• Maximum Operating Frequency: 120 MHz
• Number Of Programmable I/os: 117
• Data Ram Size: 4608 bit
• Delay Time: 200 ns
• Supply Voltage (max): 3.6 V
• Supply Current: 3 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: 0 C
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: A2F-Eval-Kit, A2F-Dev-Kit, FlashPro 3, FlashPro Lite, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.425 V
• Number Of Gates: 200000
• Package / Case: FPBGA-256
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SmartFusion Intelligent Mixed Signal FPGAs
brownout detection devices from the PCB design. Flash-based SmartFusion devices simplify total
system design and reduce cost and design risk, while increasing system reliability.
Immunity to Firm Errors
Firm errors occur most commonly when high-energy neutrons, generated in the atmosphere, strike a
configuration cell of an SRAM FPGA. The energy of the collision can change the state of the
configuration cell and thus change the logic, routing, or I/O configuration behavior in an unpredictable
way.
Another source of radiation-induced firm errors is alpha particles. For alpha radiation to cause a soft or
firm error, its source must be in very close proximity to the affected circuit. The alpha source must be in
the package molding compound or in the die itself. While low-alpha molding compounds are being used
increasingly, this helps reduce but does not entirely eliminate alpha-induced firm errors.
Firm errors are impossible to prevent in SRAM FPGAs. The consequence of this type of error can be a
complete system failure. Firm errors do not occur in SmartFusion flash-based FPGAs. Once it is
programmed, the flash cell configuration element of SmartFusion FPGAs cannot be altered by high
energy neutrons and is therefore immune to errors from them. Recoverable (or soft) errors occur in the
user data SRAMs of all FPGA devices. These can easily be mitigated by using error detection and
correction (EDAC) circuitry built into the FPGA fabric.
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