FDMC2514SDC Fairchild Semiconductor, FDMC2514SDC Datasheet

MOSFET Power 25V NChan Dual Cool PowerTrench SyncFET

FDMC2514SDC

Manufacturer Part Number
FDMC2514SDC
Description
MOSFET Power 25V NChan Dual Cool PowerTrench SyncFET
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of FDMC2514SDC

Gate Charge Qg
31 nC
Minimum Operating Temperature
- 55 C
Configuration
Dual
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
3.6 mOhms
Forward Transconductance Gfs (max / Min)
122 S
Drain-source Breakdown Voltage
25 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
24 A
Power Dissipation
3 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
Power 33
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FDMC2514SDC
Manufacturer:
0N
Quantity:
20 000
©2010 Fairchild Semiconductor Corporation
FDMC2514SDC Rev.C2
FDMC2514SDC
N-Channel Dual Cool
25 V, 40 A, 3.5 mΩ
Features
MOSFET Maximum Ratings
Thermal Characteristics
Package Marking and Ordering Information
V
V
I
E
dv/dt
P
T
R
R
R
R
R
R
R
D
DS
GS
AS
D
J
θJC
θJC
θJA
θJA
θJA
θJA
θJA
Dual Cool
Max r
Max r
High performance technology for extremely low r
SyncFET Schottky Body Diode
RoHS Compliant
, T
Symbol
Device Marking
STG
DS(on)
DS(on)
2514S
TM
= 3.5 mΩ at V
= 4.7 mΩ at V
Top Side Cooling PQFN package
Top
Drain to Source Voltage
Gate to Source Voltage
Drain Current -Continuous (Package limited)
Single Pulse Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation
Power Dissipation
Operating and Storage Junction Temperature Range
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
GS
GS
FDMC2514SDC
= 10 V, I
= 4.5 V, I
Power 33
-Continuous
-Continuous (Silicon limited)
-Pulsed
Device
TM
D
D
Pin 1
= 22.5 A
= 18 A
PowerTrench
T
A
S
= 25°C unless otherwise noted
S
Parameter
Dual Cool
DS(on)
S
G
Bottom
Package
TM
Power 33
1
D
T
T
T
T
T
General Description
This N-Channel MOSFET is produced using Fairchild
Semiconductor’s
Advancements in both silicon and Dual Cool
technologies have been combined to offer the lowest r
while maintaining excellent switching performance by extremely
low Junction-to-Ambient thermal resistance. This device has the
added benefit of an efficient monolithic Schottky body diode.
Applications
A
C
C
A
C
®
D
= 25 °C
= 25 °C
= 25 °C
= 25 °C
= 25 °C
Synchronous Rectifier for DC/DC Converters
Telecom Secondary Side Rectification
High End Server/Workstation Vcore Low Side
D
SyncFET
D
Reel Size
(Bottom Drain)
(Top Source)
13’’
(Note 1a)
(Note 1a)
(Note 1a)
(Note 1b)
(Note 1k)
(Note 1i)
(Note 1j)
(Note 4)
(Note 3)
(Note 5)
advanced
TM
D
D
D
D
5
6
7
8
Tape Width
12 mm
-55 to +150
PowerTrench
Ratings
±20
106
200
105
5.8
2.1
2.0
3.0
25
40
24
60
42
17
26
12
84
October 2010
®
www.fairchildsemi.com
TM
3000 units
Quantity
4
3
2
1
process.
package
G
S
S
Units
S
°C/W
V/ns
DS(on)
mJ
°C
W
V
V
A

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FDMC2514SDC Summary of contents

Page 1

... R Thermal Resistance, Junction to Ambient θJA Package Marking and Ordering Information Device Marking Device 2514S FDMC2514SDC ©2010 Fairchild Semiconductor Corporation FDMC2514SDC Rev.C2 TM ® PowerTrench SyncFET General Description This N-Channel MOSFET is produced using Fairchild Semiconductor’ Advancements in both silicon and Dual Cool ...

Page 2

... Gate to Source Gate Charge gs Q Gate to Drain “Miller” Charge gd Drain-Source Diode Characteristics V Source to Drain Diode Forward Voltage SD t Reverse Recovery Time rr Q Reverse Recovery Charge rr ©2010 Fairchild Semiconductor Corporation FDMC2514SDC Rev. °C unless otherwise noted J Test Conditions mA mA, referenced to 25 ° ...

Page 3

... N-ch device, the negative Vgs rating is for low duty cycle pulse ocurrence only. No continuous rating is implied. ≤ 22.5 A, di/dt ≤ 200 A/μs, V ≤ Starting DSS ©2010 Fairchild Semiconductor Corporation FDMC2514SDC Rev. °C/W when mounted pad copper 2 pad copper 2 pad copper 2 pad copper ...

Page 4

... PULSE DURATION = 80 s DUTY CYCLE = 0.5% MAX 125 1.0 1.5 2.0 2 GATE TO SOURCE VOLTAGE (V) GS Figure 5. Transfer Characteristics ©2010 Fairchild Semiconductor Corporation FDMC2514SDC Rev. °C unless otherwise noted μ PULSE DURATION = 80 s DUTY CYCLE = 0.5% MAX 100 125 150 200 100 ...

Page 5

... LIMITED BY r DS(on) SINGLE PULSE T = MAX RATED J 0 105 C/W θ 0.01 0.01 0 DRAIN to SOURCE VOLTAGE (V) DS Figure 11. Forward Bias Safe Operating Area ©2010 Fairchild Semiconductor Corporation FDMC2514SDC Rev. °C unless otherwise noted 120 100 100 2000 1000 100 us 1ms 100 ...

Page 6

... Typical Characteristics 2 DUTY CYCLE-DESCENDING ORDER 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 0.001 0.0005 - Figure 13. Junction-to-Ambient Transient Thermal Response Curve ©2010 Fairchild Semiconductor Corporation FDMC2514SDC Rev. °C unless otherwise noted J SINGLE PULSE 105 C/W θ RECTANGULAR PULSE DURATION (sec NOTES: ...

Page 7

... FDMC2514SDC di/dt = 300 100 TIME (ns) Figure 14. FDMC2514SDC SyncFET body diode reverse recovery characteristic ©2010 Fairchild Semiconductor Corporation FDMC2514SDC Rev.C2 (continued) Schottky barrier diodes exhibit significant leakage at high tem- perature and high reverse voltage. This will increase the power in the device μ ...

Page 8

... Dimensional Outline and Pad Layout ©2010 Fairchild Semiconductor Corporation FDMC2514SDC Rev.C2 8 www.fairchildsemi.com ...

Page 9

... Product Status Advance Information Formative / In Design Preliminary First Production No Identification Needed Full Production Obsolete Not In Production ©2010 Fairchild Semiconductor Corporation FDMC2514SDC Rev.C2 F-PFS™ Power-SPM™ ® FRFET PowerTrench SM Global Power Resource PowerXS™ Green FPS™ Programmable Active Droop™ ...

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